IT1060796B - Componente a semiconduttori comandabile - Google Patents

Componente a semiconduttori comandabile

Info

Publication number
IT1060796B
IT1060796B IT2388276A IT2388276A IT1060796B IT 1060796 B IT1060796 B IT 1060796B IT 2388276 A IT2388276 A IT 2388276A IT 2388276 A IT2388276 A IT 2388276A IT 1060796 B IT1060796 B IT 1060796B
Authority
IT
Italy
Prior art keywords
commandable
semiconductor component
semiconductor
component
commandable semiconductor
Prior art date
Application number
IT2388276A
Other languages
English (en)
Italian (it)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT1060796B publication Critical patent/IT1060796B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Thyristors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
IT2388276A 1975-06-06 1976-06-03 Componente a semiconduttori comandabile IT1060796B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752525390 DE2525390A1 (de) 1975-06-06 1975-06-06 Steuerbares halbleiterbauelement

Publications (1)

Publication Number Publication Date
IT1060796B true IT1060796B (it) 1982-09-30

Family

ID=5948506

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2388276A IT1060796B (it) 1975-06-06 1976-06-03 Componente a semiconduttori comandabile

Country Status (7)

Country Link
US (1) US4041523A (OSRAM)
JP (1) JPS5231678A (OSRAM)
DE (1) DE2525390A1 (OSRAM)
ES (1) ES448545A1 (OSRAM)
FR (1) FR2313776A1 (OSRAM)
GB (1) GB1502066A (OSRAM)
IT (1) IT1060796B (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5563650A (en) * 1978-11-02 1980-05-13 Nitsupi Kousan Kk Full automatic sterilizer
US4263607A (en) * 1979-03-06 1981-04-21 Alsthom-Atlantique Snap fit support housing for a semiconductor power wafer
JPS55160437A (en) * 1979-05-31 1980-12-13 Hitachi Ltd Semiconductor device
DE3221794A1 (de) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
JPS5951852A (ja) * 1982-09-17 1984-03-26 三洋電機株式会社 蒸気式滅菌器
US4587377A (en) * 1984-09-21 1986-05-06 Illinois Tool Works Inc. Electrically insulating fastener for heat sinks of different thicknesses
JP2988589B2 (ja) * 1995-12-14 1999-12-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 比較的高い電圧に適した表面実装用半導体装置及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3513361A (en) * 1968-05-09 1970-05-19 Westinghouse Electric Corp Flat package electrical device
US3525910A (en) * 1968-05-31 1970-08-25 Westinghouse Electric Corp Contact system for intricate geometry devices
US3636419A (en) * 1969-07-11 1972-01-18 Siemens Ag Pressure-biased semiconductor component free from damage to semiconductor body
BE790502A (fr) * 1971-10-26 1973-04-25 Westinghouse Electric Corp Dispositif semiconducteur encapsule a l'aide d'un elastomere
US3962719A (en) * 1974-12-05 1976-06-08 Plastronics, Inc. Mounting pad and semiconductor encapsulation device combination

Also Published As

Publication number Publication date
JPS5231678A (en) 1977-03-10
ES448545A1 (es) 1977-07-01
DE2525390A1 (de) 1976-12-16
JPS5750073B2 (OSRAM) 1982-10-25
GB1502066A (en) 1978-02-22
FR2313776A1 (fr) 1976-12-31
US4041523A (en) 1977-08-09

Similar Documents

Publication Publication Date Title
BR7601739A (pt) Coifa ossea protetica
SE7614354L (sv) Forpackning
DK288476A (da) Strammeapparat
SE7607216L (sv) Halvledaranordning
SE7512727L (sv) Forpackning
SE422768B (sv) Linlas
BE846824A (fr) Courroies
DK454376A (da) Delta 15-steroider
SE7502196L (sv) Tragliknande forpackning
SE7502685L (sv) Forpackning
SE7607360L (sv) Stellningsstege
IT1054279B (it) Dispositivo a racla
AT363426B (de) Verriegelungseinrichtung
FR2312878A1 (fr) Amplificateurs a semi-conducteurs
BE840685A (fr) Circuits a semi-conducteurs
IT1060796B (it) Componente a semiconduttori comandabile
SE7601991L (sv) Lasanordning
SE7606293L (sv) Halvledaranordning
IT1057711B (it) Pagnetron a cavita riscnante
NL7605364A (nl) Verpakkingsinrichting.
NL7604289A (nl) Halfgeleider-inrichting.
FR2329905A1 (fr) Tendeur
IT1017057B (it) Componente a semiconduttori
IT1085732B (it) Componente a semiconduttori con custodia dischiforme
BE846823A (fr) Courroies