JPS57500220A - - Google Patents
Info
- Publication number
- JPS57500220A JPS57500220A JP55502028A JP50202880A JPS57500220A JP S57500220 A JPS57500220 A JP S57500220A JP 55502028 A JP55502028 A JP 55502028A JP 50202880 A JP50202880 A JP 50202880A JP S57500220 A JPS57500220 A JP S57500220A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12091780A | 1980-02-12 | 1980-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57500220A true JPS57500220A (https=) | 1982-02-04 |
| JPS6356706B2 JPS6356706B2 (https=) | 1988-11-09 |
Family
ID=22393267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55502028A Expired JPS6356706B2 (https=) | 1980-02-12 | 1980-05-22 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS6356706B2 (https=) |
| CA (1) | CA1165465A (https=) |
| FR (1) | FR2476389A1 (https=) |
| GB (1) | GB2083285B (https=) |
| NL (1) | NL8020334A (https=) |
| WO (1) | WO1981002367A1 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58159360A (ja) * | 1982-03-17 | 1983-09-21 | Fujitsu Ltd | 半導体装置 |
| US4727410A (en) * | 1983-11-23 | 1988-02-23 | Cabot Technical Ceramics, Inc. | High density integrated circuit package |
| WO1985002941A1 (en) * | 1983-12-28 | 1985-07-04 | Hughes Aircraft Company | Flat package for integrated circuit memory chips |
| US4598308A (en) * | 1984-04-02 | 1986-07-01 | Burroughs Corporation | Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die |
| US4630096A (en) * | 1984-05-30 | 1986-12-16 | Motorola, Inc. | High density IC module assembly |
| GB2177851A (en) * | 1985-06-05 | 1987-01-28 | Spence Bate | Laminated low power circuitry components |
| EP0241236A3 (en) * | 1986-04-11 | 1989-03-08 | AT&T Corp. | Cavity package for saw devices and associated electronics |
| GB2199182A (en) * | 1986-12-18 | 1988-06-29 | Marconi Electronic Devices | Multilayer circuit arrangement |
| FR2625042B1 (fr) * | 1987-12-22 | 1990-04-20 | Thomson Csf | Structure microelectronique hybride modulaire a haute densite d'integration |
| US5150196A (en) * | 1989-07-17 | 1992-09-22 | Hughes Aircraft Company | Hermetic sealing of wafer scale integrated wafer |
| FR2772516B1 (fr) * | 1997-12-12 | 2003-07-04 | Ela Medical Sa | Circuit electronique, notamment pour un dispositif medical implantable actif tel qu'un stimulateur ou defibrillateur cardiaque, et son procede de realisation |
| GB9915076D0 (en) * | 1999-06-28 | 1999-08-25 | Shen Ming Tung | Integrated circuit packaging structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4038488A (en) * | 1975-05-12 | 1977-07-26 | Cambridge Memories, Inc. | Multilayer ceramic multi-chip, dual in-line packaging assembly |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3341649A (en) * | 1964-01-17 | 1967-09-12 | Signetics Corp | Modular package for semiconductor devices |
| US3372310A (en) * | 1965-04-30 | 1968-03-05 | Radiation Inc | Universal modular packages for integrated circuits |
| US3500440A (en) * | 1968-01-08 | 1970-03-10 | Interamericano Projects Inc | Functional building blocks facilitating mass production of electronic equipment by unskilled labor |
| US3555364A (en) * | 1968-01-31 | 1971-01-12 | Drexel Inst Of Technology | Microelectronic modules and assemblies |
| JPS5332233B1 (https=) * | 1968-12-25 | 1978-09-07 | ||
| US3746934A (en) * | 1971-05-06 | 1973-07-17 | Siemens Ag | Stack arrangement of semiconductor chips |
| US3760090A (en) * | 1971-08-19 | 1973-09-18 | Globe Union Inc | Electronic circuit package and method for making same |
| US3927815A (en) * | 1971-11-22 | 1975-12-23 | Ngk Insulators Ltd | Method for producing multilayer metallized beryllia ceramics |
| US3777220A (en) * | 1972-06-30 | 1973-12-04 | Ibm | Circuit panel and method of construction |
| US3777221A (en) * | 1972-12-18 | 1973-12-04 | Ibm | Multi-layer circuit package |
| US4012766A (en) * | 1973-08-28 | 1977-03-15 | Western Digital Corporation | Semiconductor package and method of manufacture thereof |
| US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
| US4224637A (en) * | 1978-08-10 | 1980-09-23 | Minnesota Mining And Manufacturing Company | Leaded mounting and connector unit for an electronic device |
-
1980
- 1980-05-22 NL NL8020334A patent/NL8020334A/nl unknown
- 1980-05-22 WO PCT/US1980/000662 patent/WO1981002367A1/en not_active Ceased
- 1980-05-22 JP JP55502028A patent/JPS6356706B2/ja not_active Expired
- 1980-05-22 GB GB8129603A patent/GB2083285B/en not_active Expired
-
1981
- 1981-02-11 CA CA000370651A patent/CA1165465A/en not_active Expired
- 1981-02-12 FR FR8102748A patent/FR2476389A1/fr active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4038488A (en) * | 1975-05-12 | 1977-07-26 | Cambridge Memories, Inc. | Multilayer ceramic multi-chip, dual in-line packaging assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2083285A (en) | 1982-03-17 |
| GB2083285B (en) | 1984-08-15 |
| FR2476389A1 (fr) | 1981-08-21 |
| WO1981002367A1 (en) | 1981-08-20 |
| FR2476389B1 (https=) | 1983-12-16 |
| NL8020334A (https=) | 1982-01-04 |
| CA1165465A (en) | 1984-04-10 |
| JPS6356706B2 (https=) | 1988-11-09 |