JPS5748879B2 - - Google Patents

Info

Publication number
JPS5748879B2
JPS5748879B2 JP54158750A JP15875079A JPS5748879B2 JP S5748879 B2 JPS5748879 B2 JP S5748879B2 JP 54158750 A JP54158750 A JP 54158750A JP 15875079 A JP15875079 A JP 15875079A JP S5748879 B2 JPS5748879 B2 JP S5748879B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54158750A
Other languages
Japanese (ja)
Other versions
JPS55130197A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS55130197A publication Critical patent/JPS55130197A/ja
Publication of JPS5748879B2 publication Critical patent/JPS5748879B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00—Photosensitive materials
    • G03C1/705—Compositions containing chalcogenides, metals or alloys thereof, as photosensitive substances, e.g. photodope systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Surface Treatment Of Glass (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Photoreceptors In Electrophotography (AREA)
JP15875079A 1973-11-29 1979-12-08 Method of fabricating printed circuit board Granted JPS55130197A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7316313A NL7316313A (nl) 1973-11-29 1973-11-29 Werkwijze voor de vervaardiging van lichtgevoelig materiaal.

Publications (2)

Publication Number Publication Date
JPS55130197A JPS55130197A (en) 1980-10-08
JPS5748879B2 true JPS5748879B2 (de) 1982-10-19

Family

ID=19820099

Family Applications (2)

Application Number Title Priority Date Filing Date
JP13525974A Expired JPS567219B2 (de) 1973-11-29 1974-11-26
JP15875079A Granted JPS55130197A (en) 1973-11-29 1979-12-08 Method of fabricating printed circuit board

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP13525974A Expired JPS567219B2 (de) 1973-11-29 1974-11-26

Country Status (11)

Country Link
JP (2) JPS567219B2 (de)
AT (1) AT363540B (de)
BE (1) BE822669A (de)
CA (1) CA1041644A (de)
DE (1) DE2454536A1 (de)
FR (1) FR2253229B1 (de)
GB (1) GB1487227A (de)
HK (1) HK41678A (de)
IT (1) IT1026507B (de)
NL (1) NL7316313A (de)
SE (1) SE404558B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376815A (en) * 1979-10-22 1983-03-15 Oddi Michael J Method of applying photoresist by screening in the formation of printed circuits
JPS5723416A (en) * 1980-07-17 1982-02-06 Suwa Seikosha Kk Method of forming pattern of insulating substrate
JPS5831760B2 (ja) * 1981-01-09 1983-07-08 株式会社東芝 プリント配線板の製造方法
JPS5878493A (ja) * 1981-11-05 1983-05-12 塩尻工業株式会社 プリント配線板
CN100390319C (zh) * 2001-08-31 2008-05-28 关东化成工业株式会社 绝缘体制品的镀敷方法
CN110975865B (zh) * 2019-12-20 2022-09-02 绍兴蓝竹新材料科技有限公司 高导光率高吸附性能净化空气用光催化复合剂的制备方法
CN112479597A (zh) * 2020-12-07 2021-03-12 陕西拓日新能源科技有限公司 一种光伏玻璃的双面镀膜工艺

Also Published As

Publication number Publication date
FR2253229A1 (de) 1975-06-27
JPS5085876A (de) 1975-07-10
SE404558B (sv) 1978-10-09
HK41678A (en) 1978-07-28
BE822669A (fr) 1975-05-27
AT363540B (de) 1981-08-10
DE2454536A1 (de) 1975-06-05
NL7316313A (nl) 1975-06-02
GB1487227A (en) 1977-09-28
FR2253229B1 (de) 1979-05-25
CA1041644A (en) 1978-10-31
JPS55130197A (en) 1980-10-08
IT1026507B (it) 1978-10-20
SE7414805L (de) 1975-05-30
JPS567219B2 (de) 1981-02-17
ATA945974A (de) 1981-01-15

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