JPS5748869B2 - - Google Patents
Info
- Publication number
- JPS5748869B2 JPS5748869B2 JP47018038A JP1803872A JPS5748869B2 JP S5748869 B2 JPS5748869 B2 JP S5748869B2 JP 47018038 A JP47018038 A JP 47018038A JP 1803872 A JP1803872 A JP 1803872A JP S5748869 B2 JPS5748869 B2 JP S5748869B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47018038A JPS5748869B2 (en:Method) | 1972-02-23 | 1972-02-23 | |
| US410524A US3909620A (en) | 1972-02-23 | 1973-10-29 | Time controlled switching system with override control of manual operation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47018038A JPS5748869B2 (en:Method) | 1972-02-23 | 1972-02-23 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58120362A Division JPS5936980A (ja) | 1983-07-04 | 1983-07-04 | セラミック配線基板とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4888884A JPS4888884A (en:Method) | 1973-11-21 |
| JPS5748869B2 true JPS5748869B2 (en:Method) | 1982-10-19 |
Family
ID=11960493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47018038A Expired JPS5748869B2 (en:Method) | 1972-02-23 | 1972-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5748869B2 (en:Method) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5516473B2 (en:Method) * | 1974-05-20 | 1980-05-02 | ||
| JPS5175178U (en:Method) * | 1974-12-10 | 1976-06-12 | ||
| JPS51107281U (en:Method) * | 1975-02-25 | 1976-08-27 | ||
| JPS5937598B2 (ja) * | 1980-04-07 | 1984-09-11 | 日本電気株式会社 | 半導体装置 |
| JPS56124248A (en) * | 1981-02-23 | 1981-09-29 | Nec Corp | Semiconductor device |
| JPS6063957A (ja) * | 1983-09-17 | 1985-04-12 | Toshiba Corp | イメ−ジセンサ |
| JPH0680839B2 (ja) * | 1984-06-12 | 1994-10-12 | 三洋電機株式会社 | 発光ダイオ−ド配列体 |
| JPH08759Y2 (ja) * | 1989-06-26 | 1996-01-10 | 京セラ株式会社 | 半導体素子収納用パッケージ |
-
1972
- 1972-02-23 JP JP47018038A patent/JPS5748869B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4888884A (en:Method) | 1973-11-21 |