JPS4888884A - - Google Patents

Info

Publication number
JPS4888884A
JPS4888884A JP47018038A JP1803872A JPS4888884A JP S4888884 A JPS4888884 A JP S4888884A JP 47018038 A JP47018038 A JP 47018038A JP 1803872 A JP1803872 A JP 1803872A JP S4888884 A JPS4888884 A JP S4888884A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47018038A
Other languages
Japanese (ja)
Other versions
JPS5748869B2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47018038A priority Critical patent/JPS5748869B2/ja
Priority to US410524A priority patent/US3909620A/en
Publication of JPS4888884A publication Critical patent/JPS4888884A/ja
Publication of JPS5748869B2 publication Critical patent/JPS5748869B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP47018038A 1972-02-23 1972-02-23 Expired JPS5748869B2 (en:Method)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP47018038A JPS5748869B2 (en:Method) 1972-02-23 1972-02-23
US410524A US3909620A (en) 1972-02-23 1973-10-29 Time controlled switching system with override control of manual operation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47018038A JPS5748869B2 (en:Method) 1972-02-23 1972-02-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58120362A Division JPS5936980A (ja) 1983-07-04 1983-07-04 セラミック配線基板とその製造方法

Publications (2)

Publication Number Publication Date
JPS4888884A true JPS4888884A (en:Method) 1973-11-21
JPS5748869B2 JPS5748869B2 (en:Method) 1982-10-19

Family

ID=11960493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47018038A Expired JPS5748869B2 (en:Method) 1972-02-23 1972-02-23

Country Status (1)

Country Link
JP (1) JPS5748869B2 (en:Method)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148859A (en:Method) * 1974-05-20 1975-11-28
JPS5175178U (en:Method) * 1974-12-10 1976-06-12
JPS51107281U (en:Method) * 1975-02-25 1976-08-27
JPS55146995A (en) * 1980-04-07 1980-11-15 Nippon Electric Co Semiconductor device
JPS56124248A (en) * 1981-02-23 1981-09-29 Nec Corp Semiconductor device
JPS6063957A (ja) * 1983-09-17 1985-04-12 Toshiba Corp イメ−ジセンサ
JPS60263483A (ja) * 1984-06-12 1985-12-26 Sanyo Electric Co Ltd 発光ダイオ−ド配列体
JPH0313742U (en:Method) * 1989-06-26 1991-02-12

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148859A (en:Method) * 1974-05-20 1975-11-28
JPS5175178U (en:Method) * 1974-12-10 1976-06-12
JPS51107281U (en:Method) * 1975-02-25 1976-08-27
JPS55146995A (en) * 1980-04-07 1980-11-15 Nippon Electric Co Semiconductor device
JPS56124248A (en) * 1981-02-23 1981-09-29 Nec Corp Semiconductor device
JPS6063957A (ja) * 1983-09-17 1985-04-12 Toshiba Corp イメ−ジセンサ
JPS60263483A (ja) * 1984-06-12 1985-12-26 Sanyo Electric Co Ltd 発光ダイオ−ド配列体
JPH0313742U (en:Method) * 1989-06-26 1991-02-12

Also Published As

Publication number Publication date
JPS5748869B2 (en:Method) 1982-10-19

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