JPS5747933B2 - - Google Patents
Info
- Publication number
- JPS5747933B2 JPS5747933B2 JP8408576A JP8408576A JPS5747933B2 JP S5747933 B2 JPS5747933 B2 JP S5747933B2 JP 8408576 A JP8408576 A JP 8408576A JP 8408576 A JP8408576 A JP 8408576A JP S5747933 B2 JPS5747933 B2 JP S5747933B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Paints Or Removers (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8408576A JPS538634A (en) | 1976-07-14 | 1976-07-14 | Coating liquid for laser scriber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8408576A JPS538634A (en) | 1976-07-14 | 1976-07-14 | Coating liquid for laser scriber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS538634A JPS538634A (en) | 1978-01-26 |
| JPS5747933B2 true JPS5747933B2 (en18) | 1982-10-13 |
Family
ID=13820647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8408576A Granted JPS538634A (en) | 1976-07-14 | 1976-07-14 | Coating liquid for laser scriber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS538634A (en18) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS64113Y2 (en18) * | 1985-07-19 | 1989-01-05 | ||
| JP2006527477A (ja) * | 2003-06-06 | 2006-11-30 | エグシル テクノロジー リミテッド | 界面活性剤膜を用いるレーザ切削加工 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52122291U (en18) * | 1976-03-12 | 1977-09-17 | ||
| JPS58136660A (ja) * | 1982-02-05 | 1983-08-13 | Daicel Chem Ind Ltd | マスキング塗料用組成物 |
| JP4571850B2 (ja) | 2004-11-12 | 2010-10-27 | 東京応化工業株式会社 | レーザーダイシング用保護膜剤及び該保護膜剤を用いたウエーハの加工方法 |
| US9048309B2 (en) * | 2012-07-10 | 2015-06-02 | Applied Materials, Inc. | Uniform masking for wafer dicing using laser and plasma etch |
| KR101896710B1 (ko) | 2012-08-29 | 2018-09-10 | 동우 화인켐 주식회사 | 레이저 다이싱용 웨이퍼 보호막 조성물 |
| JP6242776B2 (ja) * | 2014-09-26 | 2017-12-06 | 富士フイルム株式会社 | 保護膜組成物、半導体装置の製造方法およびレーザーダイシング方法 |
| JP6739873B2 (ja) * | 2016-11-08 | 2020-08-12 | 株式会社ディスコ | ウェーハの加工方法 |
-
1976
- 1976-07-14 JP JP8408576A patent/JPS538634A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS64113Y2 (en18) * | 1985-07-19 | 1989-01-05 | ||
| JP2006527477A (ja) * | 2003-06-06 | 2006-11-30 | エグシル テクノロジー リミテッド | 界面活性剤膜を用いるレーザ切削加工 |
| JP2012110964A (ja) * | 2003-06-06 | 2012-06-14 | Electro Scientific Industries Inc | 界面活性剤膜を用いるレーザ切削加工 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS538634A (en) | 1978-01-26 |