JPS5746662B2 - - Google Patents

Info

Publication number
JPS5746662B2
JPS5746662B2 JP53152131A JP15213178A JPS5746662B2 JP S5746662 B2 JPS5746662 B2 JP S5746662B2 JP 53152131 A JP53152131 A JP 53152131A JP 15213178 A JP15213178 A JP 15213178A JP S5746662 B2 JPS5746662 B2 JP S5746662B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53152131A
Other languages
Japanese (ja)
Other versions
JPS5489571A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5489571A publication Critical patent/JPS5489571A/ja
Publication of JPS5746662B2 publication Critical patent/JPS5746662B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/701
    • H10W70/68
    • H10W70/688
    • H10W70/655

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15213178A 1977-12-13 1978-12-11 Semiconductor device Granted JPS5489571A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7713758A NL7713758A (nl) 1977-12-13 1977-12-13 Halfgeleiderinrichting.

Publications (2)

Publication Number Publication Date
JPS5489571A JPS5489571A (en) 1979-07-16
JPS5746662B2 true JPS5746662B2 (cg-RX-API-DMAC10.html) 1982-10-05

Family

ID=19829740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15213178A Granted JPS5489571A (en) 1977-12-13 1978-12-11 Semiconductor device

Country Status (7)

Country Link
US (1) US4215359A (cg-RX-API-DMAC10.html)
JP (1) JPS5489571A (cg-RX-API-DMAC10.html)
BR (1) BR7808124A (cg-RX-API-DMAC10.html)
DE (1) DE2853328C2 (cg-RX-API-DMAC10.html)
FR (1) FR2412167A1 (cg-RX-API-DMAC10.html)
GB (1) GB2010013B (cg-RX-API-DMAC10.html)
NL (1) NL7713758A (cg-RX-API-DMAC10.html)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0016522B1 (en) * 1979-02-19 1982-12-22 Fujitsu Limited Semiconductor device and method for manufacturing the same
JPS57173113A (en) * 1981-04-17 1982-10-25 Mitsubishi Heavy Ind Ltd Continuous mixer for powdered body milk of cement, etc.
CA1212484A (en) * 1982-04-19 1986-10-07 Sheldon H. Butt Semiconductor package
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4819041A (en) * 1983-12-30 1989-04-04 Amp Incorporated Surface mounted integrated circuit chip package and method for making same
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
DE69010546T2 (de) * 1989-04-17 1995-02-09 Matsushita Electric Ind Co Ltd Hochfrequenz-Halbleiteranordnung.
DE3912893A1 (de) * 1989-04-19 1990-10-25 Siemens Ag Als mikropack montierte halbleiteranordnung
US5077598A (en) * 1989-11-08 1991-12-31 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
US5047830A (en) * 1990-05-22 1991-09-10 Amp Incorporated Field emitter array integrated circuit chip interconnection
DE69329542T2 (de) * 1992-06-05 2001-02-08 Mitsui Chemicals, Inc. Dreidimensionale leiterplatte, elektronische bauelementanordnung unter verwendung dieser leiterplatte und herstellungsverfahren zu dieser leiterplatte
US6891110B1 (en) 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
CA2302957C (en) * 1999-03-24 2009-06-30 Morgan Adhesives Company Circuit chip connector and method of connecting a circuit chip
EP1109214A1 (de) * 1999-12-16 2001-06-20 Infineon Technologies AG Anordnung und Verfahren zur Kontaktierung von Schaltkreisen
RU2190768C1 (ru) * 2001-02-07 2002-10-10 Военный автомобильный институт Каталитический нейтрализатор для двс
NL1021245C2 (nl) * 2002-08-09 2004-02-10 Tno Drager voor tenminste een IC en systemen omvattende een dergelijke drager en een IC en/of een dergelijke drager en een verbindingsplaat.
US20050282355A1 (en) * 2004-06-18 2005-12-22 Edwards David N High density bonding of electrical devices
DE102004030383A1 (de) * 2004-06-23 2006-01-12 Infineon Technologies Ag Bondfolie und Halbleiterbauteil mit Bondfolie sowie Verfahren zu deren Herstellung
US8067253B2 (en) * 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2151765C2 (de) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen
US3743893A (en) * 1971-05-27 1973-07-03 Mitsubishi Electric Corp Fluid cooled compression bonded semiconductor device structure
DE2253627A1 (de) * 1972-11-02 1974-05-16 Philips Patentverwaltung Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement

Also Published As

Publication number Publication date
FR2412167A1 (fr) 1979-07-13
JPS5489571A (en) 1979-07-16
FR2412167B1 (cg-RX-API-DMAC10.html) 1984-10-19
BR7808124A (pt) 1979-07-31
GB2010013A (en) 1979-06-20
US4215359A (en) 1980-07-29
DE2853328A1 (de) 1979-06-21
GB2010013B (en) 1982-02-17
DE2853328C2 (de) 1985-08-01
NL7713758A (nl) 1979-06-15

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