FR2412167B1 - - Google Patents
Info
- Publication number
- FR2412167B1 FR2412167B1 FR7834817A FR7834817A FR2412167B1 FR 2412167 B1 FR2412167 B1 FR 2412167B1 FR 7834817 A FR7834817 A FR 7834817A FR 7834817 A FR7834817 A FR 7834817A FR 2412167 B1 FR2412167 B1 FR 2412167B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/701—
-
- H10W70/68—
-
- H10W70/688—
-
- H10W70/655—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7713758A NL7713758A (nl) | 1977-12-13 | 1977-12-13 | Halfgeleiderinrichting. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2412167A1 FR2412167A1 (fr) | 1979-07-13 |
| FR2412167B1 true FR2412167B1 (cg-RX-API-DMAC10.html) | 1984-10-19 |
Family
ID=19829740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7834817A Granted FR2412167A1 (fr) | 1977-12-13 | 1978-12-11 | Dispositif semi-conducteur, comportant une feuille mince flexible et isolante |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4215359A (cg-RX-API-DMAC10.html) |
| JP (1) | JPS5489571A (cg-RX-API-DMAC10.html) |
| BR (1) | BR7808124A (cg-RX-API-DMAC10.html) |
| DE (1) | DE2853328C2 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2412167A1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB2010013B (cg-RX-API-DMAC10.html) |
| NL (1) | NL7713758A (cg-RX-API-DMAC10.html) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0016522B1 (en) * | 1979-02-19 | 1982-12-22 | Fujitsu Limited | Semiconductor device and method for manufacturing the same |
| JPS57173113A (en) * | 1981-04-17 | 1982-10-25 | Mitsubishi Heavy Ind Ltd | Continuous mixer for powdered body milk of cement, etc. |
| CA1212484A (en) * | 1982-04-19 | 1986-10-07 | Sheldon H. Butt | Semiconductor package |
| US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
| US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
| US4819041A (en) * | 1983-12-30 | 1989-04-04 | Amp Incorporated | Surface mounted integrated circuit chip package and method for making same |
| US4843036A (en) * | 1987-06-29 | 1989-06-27 | Eastman Kodak Company | Method for encapsulating electronic devices |
| DE69010546T2 (de) * | 1989-04-17 | 1995-02-09 | Matsushita Electric Ind Co Ltd | Hochfrequenz-Halbleiteranordnung. |
| DE3912893A1 (de) * | 1989-04-19 | 1990-10-25 | Siemens Ag | Als mikropack montierte halbleiteranordnung |
| US5077598A (en) * | 1989-11-08 | 1991-12-31 | Hewlett-Packard Company | Strain relief flip-chip integrated circuit assembly with test fixturing |
| US5047830A (en) * | 1990-05-22 | 1991-09-10 | Amp Incorporated | Field emitter array integrated circuit chip interconnection |
| DE69329542T2 (de) * | 1992-06-05 | 2001-02-08 | Mitsui Chemicals, Inc. | Dreidimensionale leiterplatte, elektronische bauelementanordnung unter verwendung dieser leiterplatte und herstellungsverfahren zu dieser leiterplatte |
| US6891110B1 (en) | 1999-03-24 | 2005-05-10 | Motorola, Inc. | Circuit chip connector and method of connecting a circuit chip |
| CA2302957C (en) * | 1999-03-24 | 2009-06-30 | Morgan Adhesives Company | Circuit chip connector and method of connecting a circuit chip |
| EP1109214A1 (de) * | 1999-12-16 | 2001-06-20 | Infineon Technologies AG | Anordnung und Verfahren zur Kontaktierung von Schaltkreisen |
| RU2190768C1 (ru) * | 2001-02-07 | 2002-10-10 | Военный автомобильный институт | Каталитический нейтрализатор для двс |
| NL1021245C2 (nl) * | 2002-08-09 | 2004-02-10 | Tno | Drager voor tenminste een IC en systemen omvattende een dergelijke drager en een IC en/of een dergelijke drager en een verbindingsplaat. |
| US20050282355A1 (en) * | 2004-06-18 | 2005-12-22 | Edwards David N | High density bonding of electrical devices |
| DE102004030383A1 (de) * | 2004-06-23 | 2006-01-12 | Infineon Technologies Ag | Bondfolie und Halbleiterbauteil mit Bondfolie sowie Verfahren zu deren Herstellung |
| US8067253B2 (en) * | 2005-12-21 | 2011-11-29 | Avery Dennison Corporation | Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2151765C2 (de) * | 1970-11-05 | 1983-06-16 | Honeywell Information Systems Italia S.p.A., Caluso, Torino | Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen |
| US3743893A (en) * | 1971-05-27 | 1973-07-03 | Mitsubishi Electric Corp | Fluid cooled compression bonded semiconductor device structure |
| DE2253627A1 (de) * | 1972-11-02 | 1974-05-16 | Philips Patentverwaltung | Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement |
-
1977
- 1977-12-13 NL NL7713758A patent/NL7713758A/xx not_active Application Discontinuation
-
1978
- 1978-11-08 US US05/958,769 patent/US4215359A/en not_active Expired - Lifetime
- 1978-12-08 GB GB7847711A patent/GB2010013B/en not_active Expired
- 1978-12-09 DE DE2853328A patent/DE2853328C2/de not_active Expired
- 1978-12-11 JP JP15213178A patent/JPS5489571A/ja active Granted
- 1978-12-11 FR FR7834817A patent/FR2412167A1/fr active Granted
- 1978-12-11 BR BR7808124A patent/BR7808124A/pt unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR2412167A1 (fr) | 1979-07-13 |
| JPS5489571A (en) | 1979-07-16 |
| JPS5746662B2 (cg-RX-API-DMAC10.html) | 1982-10-05 |
| BR7808124A (pt) | 1979-07-31 |
| GB2010013A (en) | 1979-06-20 |
| US4215359A (en) | 1980-07-29 |
| DE2853328A1 (de) | 1979-06-21 |
| GB2010013B (en) | 1982-02-17 |
| DE2853328C2 (de) | 1985-08-01 |
| NL7713758A (nl) | 1979-06-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |