JPS5745962A - Substrate, electronic circuit device and method of producing same - Google Patents

Substrate, electronic circuit device and method of producing same

Info

Publication number
JPS5745962A
JPS5745962A JP56091668A JP9166881A JPS5745962A JP S5745962 A JPS5745962 A JP S5745962A JP 56091668 A JP56091668 A JP 56091668A JP 9166881 A JP9166881 A JP 9166881A JP S5745962 A JPS5745962 A JP S5745962A
Authority
JP
Japan
Prior art keywords
substrate
electronic circuit
circuit device
producing same
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56091668A
Other languages
English (en)
Japanese (ja)
Inventor
Edouado Baatori Jian
Rei Penrado Oobuiru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Allen Bradley Co LLC
Original Assignee
Allen Bradley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allen Bradley Co LLC filed Critical Allen Bradley Co LLC
Publication of JPS5745962A publication Critical patent/JPS5745962A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)
JP56091668A 1980-08-25 1981-06-16 Substrate, electronic circuit device and method of producing same Pending JPS5745962A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18132980A 1980-08-25 1980-08-25

Publications (1)

Publication Number Publication Date
JPS5745962A true JPS5745962A (en) 1982-03-16

Family

ID=22663824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56091668A Pending JPS5745962A (en) 1980-08-25 1981-06-16 Substrate, electronic circuit device and method of producing same

Country Status (5)

Country Link
JP (1) JPS5745962A (enExample)
CA (1) CA1151257A (enExample)
DE (1) DE3133584A1 (enExample)
FR (1) FR2489044A1 (enExample)
GB (1) GB2082843B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406537A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung eines leistungshalbleiterbauelementes auf einem isolierenden und mit leiterbahnen versehenen substrat
GB2248345B (en) * 1990-09-27 1994-06-22 Stc Plc Edge soldering of electronic components
CN112074095B (zh) * 2020-10-10 2021-08-31 黄石星河电路有限公司 一种四周设计0.4mm金属半孔的薄板加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5045963A (enExample) * 1973-08-20 1975-04-24
JPS5089874A (enExample) * 1973-12-12 1975-07-18
JPS5229966A (en) * 1975-09-02 1977-03-07 Allen Bradley Co Method of connecting electric circuit device and terminal leads firmly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5045963A (enExample) * 1973-08-20 1975-04-24
JPS5089874A (enExample) * 1973-12-12 1975-07-18
JPS5229966A (en) * 1975-09-02 1977-03-07 Allen Bradley Co Method of connecting electric circuit device and terminal leads firmly

Also Published As

Publication number Publication date
GB2082843B (en) 1984-09-19
CA1151257A (en) 1983-08-02
GB2082843A (en) 1982-03-10
FR2489044B3 (enExample) 1983-06-17
DE3133584A1 (de) 1982-07-01
FR2489044A1 (fr) 1982-02-26

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