JPS5745928A - Surface cleaning device - Google Patents

Surface cleaning device

Info

Publication number
JPS5745928A
JPS5745928A JP12116280A JP12116280A JPS5745928A JP S5745928 A JPS5745928 A JP S5745928A JP 12116280 A JP12116280 A JP 12116280A JP 12116280 A JP12116280 A JP 12116280A JP S5745928 A JPS5745928 A JP S5745928A
Authority
JP
Japan
Prior art keywords
wafer
cleaning
wafers
treating
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12116280A
Other languages
Japanese (ja)
Inventor
Haruo Amada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12116280A priority Critical patent/JPS5745928A/en
Publication of JPS5745928A publication Critical patent/JPS5745928A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

PURPOSE:To improve the safety of a device for cleaning the surface of a semiconductor wafer by composing the devide of a dehydration baking treating means and chemically dehydrating means, integrating them, and employing a microwave generator as heating means for the baking means, thereby eliminating silane coupling gas inflammation and the like. CONSTITUTION:A semiconductor wafer surface cleaning device is composed of a loader 3 for supplying wafers 1 one by one from a cartridge 2, and a conveyor 4 for conveying the supplied wafer 1 to respective treating sections. Further, the device is composed of a cleaning section 5 for forcibly cleaning the wafer 1 thus conveyed in contact with the conveyor by brush cleaning and rotatably drying it, and a dehydration baking section 6 for dehydrating the water content on the surface of the wafer 1 by microwave induction heating in a short time. Moreover, the device has a chemically dehydrating section 7 for chemically removing the OH group of the surface of the wafer 1, and an unloader 9 for setting a cartridge 8 and containing the wafers 1 one by one after treating the wafers 1, and all these sections are controlled by a controller 10.
JP12116280A 1980-09-03 1980-09-03 Surface cleaning device Pending JPS5745928A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12116280A JPS5745928A (en) 1980-09-03 1980-09-03 Surface cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12116280A JPS5745928A (en) 1980-09-03 1980-09-03 Surface cleaning device

Publications (1)

Publication Number Publication Date
JPS5745928A true JPS5745928A (en) 1982-03-16

Family

ID=14804370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12116280A Pending JPS5745928A (en) 1980-09-03 1980-09-03 Surface cleaning device

Country Status (1)

Country Link
JP (1) JPS5745928A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211643A (en) * 1986-03-12 1987-09-17 Mitsubishi Electric Corp Coating method for adhesion intensifying agent
JPS6373626A (en) * 1986-09-17 1988-04-04 Hitachi Ltd Treating device
JPS63236333A (en) * 1987-03-25 1988-10-03 Hitachi Ltd Method of washing and drying substrate
CN109513662A (en) * 2018-10-24 2019-03-26 田锦海 A kind of building monitoring settlement observation level object lens cleaning device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211643A (en) * 1986-03-12 1987-09-17 Mitsubishi Electric Corp Coating method for adhesion intensifying agent
JPS6373626A (en) * 1986-09-17 1988-04-04 Hitachi Ltd Treating device
JPS63236333A (en) * 1987-03-25 1988-10-03 Hitachi Ltd Method of washing and drying substrate
CN109513662A (en) * 2018-10-24 2019-03-26 田锦海 A kind of building monitoring settlement observation level object lens cleaning device
CN109513662B (en) * 2018-10-24 2020-12-11 博兴兴博城建投资集团有限公司 Surveyor's level objective cleaning device for building monitoring settlement observation

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