JPS574239U - - Google Patents
Info
- Publication number
- JPS574239U JPS574239U JP1980079007U JP7900780U JPS574239U JP S574239 U JPS574239 U JP S574239U JP 1980079007 U JP1980079007 U JP 1980079007U JP 7900780 U JP7900780 U JP 7900780U JP S574239 U JPS574239 U JP S574239U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980079007U JPS6225907Y2 (enFirst) | 1980-06-06 | 1980-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980079007U JPS6225907Y2 (enFirst) | 1980-06-06 | 1980-06-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS574239U true JPS574239U (enFirst) | 1982-01-09 |
| JPS6225907Y2 JPS6225907Y2 (enFirst) | 1987-07-02 |
Family
ID=29441507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980079007U Expired JPS6225907Y2 (enFirst) | 1980-06-06 | 1980-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6225907Y2 (enFirst) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59130266A (ja) * | 1976-07-23 | 1984-07-26 | ザ・グッドイヤ−・タイヤ・アンド・ラバ−・カンパニ− | スルフイルイミン類 |
| JPS61131845U (enFirst) * | 1985-02-05 | 1986-08-18 | ||
| JPS63244657A (ja) * | 1987-03-30 | 1988-10-12 | Toshiba Corp | 半導体装置 |
| JPH01120041A (ja) * | 1987-07-20 | 1989-05-12 | Linear Technol Inc | 集積回路パッケージ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085752U (enFirst) * | 1973-12-10 | 1975-07-22 | ||
| JPS546567U (enFirst) * | 1977-06-17 | 1979-01-17 |
-
1980
- 1980-06-06 JP JP1980079007U patent/JPS6225907Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085752U (enFirst) * | 1973-12-10 | 1975-07-22 | ||
| JPS546567U (enFirst) * | 1977-06-17 | 1979-01-17 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59130266A (ja) * | 1976-07-23 | 1984-07-26 | ザ・グッドイヤ−・タイヤ・アンド・ラバ−・カンパニ− | スルフイルイミン類 |
| JPS61131845U (enFirst) * | 1985-02-05 | 1986-08-18 | ||
| JPS63244657A (ja) * | 1987-03-30 | 1988-10-12 | Toshiba Corp | 半導体装置 |
| JPH01120041A (ja) * | 1987-07-20 | 1989-05-12 | Linear Technol Inc | 集積回路パッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6225907Y2 (enFirst) | 1987-07-02 |