JPS574239U - - Google Patents

Info

Publication number
JPS574239U
JPS574239U JP7900780U JP7900780U JPS574239U JP S574239 U JPS574239 U JP S574239U JP 7900780 U JP7900780 U JP 7900780U JP 7900780 U JP7900780 U JP 7900780U JP S574239 U JPS574239 U JP S574239U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7900780U
Other languages
Japanese (ja)
Other versions
JPS6225907Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980079007U priority Critical patent/JPS6225907Y2/ja
Publication of JPS574239U publication Critical patent/JPS574239U/ja
Application granted granted Critical
Publication of JPS6225907Y2 publication Critical patent/JPS6225907Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1980079007U 1980-06-06 1980-06-06 Expired JPS6225907Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980079007U JPS6225907Y2 (enrdf_load_html_response) 1980-06-06 1980-06-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980079007U JPS6225907Y2 (enrdf_load_html_response) 1980-06-06 1980-06-06

Publications (2)

Publication Number Publication Date
JPS574239U true JPS574239U (enrdf_load_html_response) 1982-01-09
JPS6225907Y2 JPS6225907Y2 (enrdf_load_html_response) 1987-07-02

Family

ID=29441507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980079007U Expired JPS6225907Y2 (enrdf_load_html_response) 1980-06-06 1980-06-06

Country Status (1)

Country Link
JP (1) JPS6225907Y2 (enrdf_load_html_response)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130266A (ja) * 1976-07-23 1984-07-26 ザ・グッドイヤ−・タイヤ・アンド・ラバ−・カンパニ− スルフイルイミン類
JPS61131845U (enrdf_load_html_response) * 1985-02-05 1986-08-18
JPS63244657A (ja) * 1987-03-30 1988-10-12 Toshiba Corp 半導体装置
JPH01120041A (ja) * 1987-07-20 1989-05-12 Linear Technol Inc 集積回路パッケージ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5085752U (enrdf_load_html_response) * 1973-12-10 1975-07-22
JPS546567U (enrdf_load_html_response) * 1977-06-17 1979-01-17

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5085752U (enrdf_load_html_response) * 1973-12-10 1975-07-22
JPS546567U (enrdf_load_html_response) * 1977-06-17 1979-01-17

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130266A (ja) * 1976-07-23 1984-07-26 ザ・グッドイヤ−・タイヤ・アンド・ラバ−・カンパニ− スルフイルイミン類
JPS61131845U (enrdf_load_html_response) * 1985-02-05 1986-08-18
JPS63244657A (ja) * 1987-03-30 1988-10-12 Toshiba Corp 半導体装置
JPH01120041A (ja) * 1987-07-20 1989-05-12 Linear Technol Inc 集積回路パッケージ

Also Published As

Publication number Publication date
JPS6225907Y2 (enrdf_load_html_response) 1987-07-02

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