JPS574178A - Method and apparatus for assembling solid pickup device - Google Patents

Method and apparatus for assembling solid pickup device

Info

Publication number
JPS574178A
JPS574178A JP7736080A JP7736080A JPS574178A JP S574178 A JPS574178 A JP S574178A JP 7736080 A JP7736080 A JP 7736080A JP 7736080 A JP7736080 A JP 7736080A JP S574178 A JPS574178 A JP S574178A
Authority
JP
Japan
Prior art keywords
chip
filter
charge transfer
adhesives
optical filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7736080A
Other languages
Japanese (ja)
Inventor
Yoshiaki Hayashimoto
Nozomi Harada
Okio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7736080A priority Critical patent/JPS574178A/en
Publication of JPS574178A publication Critical patent/JPS574178A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE:To paste a charge transfer element and an optical filter together in high accuracy by a method wherein signals obtained from the charge transfer element and signals from a pickup location observing from the optical filter side are compared, and pasting is positioned. CONSTITUTION:A device 9 previously mounted is set on a socket 21 on a bench 23. The device is set accurately so that a crossed mark of the charge transfer element CCD is conformed to a base line within a visual field of a binocular objective microscope 29. Adhesives 14 are dropped on a chip of the element CCD, and the optical filter 11 with a color striped filter is brought close on the chip of the element CCD while being contacted with the adhesives. An upper surface of the chip and a lower surface of the filter 11 are wetted, both relative positions are made easy to be observed by means of the microscope, the filter 11 is moved until the adhesives cure, and the crossed mark is positioned to the crossed mark of the chip.
JP7736080A 1980-06-09 1980-06-09 Method and apparatus for assembling solid pickup device Pending JPS574178A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7736080A JPS574178A (en) 1980-06-09 1980-06-09 Method and apparatus for assembling solid pickup device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7736080A JPS574178A (en) 1980-06-09 1980-06-09 Method and apparatus for assembling solid pickup device

Publications (1)

Publication Number Publication Date
JPS574178A true JPS574178A (en) 1982-01-09

Family

ID=13631733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7736080A Pending JPS574178A (en) 1980-06-09 1980-06-09 Method and apparatus for assembling solid pickup device

Country Status (1)

Country Link
JP (1) JPS574178A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254917A (en) * 1985-05-07 1986-11-12 Asahi Optical Co Ltd Tip part structure of endoscope
JP2013046353A (en) * 2011-08-26 2013-03-04 Ricoh Co Ltd Manufacturing method and manufacturing device of imaging apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254917A (en) * 1985-05-07 1986-11-12 Asahi Optical Co Ltd Tip part structure of endoscope
JP2013046353A (en) * 2011-08-26 2013-03-04 Ricoh Co Ltd Manufacturing method and manufacturing device of imaging apparatus

Similar Documents

Publication Publication Date Title
JPS6470112A (en) Filter and device for distributing and receiving filtrate
JPS57117238A (en) Exposing and baking device for manufacturing integrated circuit with illuminometer
EP0248679A3 (en) Method of using and apparatus for use in a microscope
AU540448B2 (en) A test stand for testing hydraulic apparatus
JPS5559416A (en) Connector for optical fiber and device for mounting optical fiber on the sleeve directly useable for connector
JPS57167651A (en) Inspecting device for surface of semiconductor wafer
JPS574178A (en) Method and apparatus for assembling solid pickup device
CN107134419A (en) Flip-chip bonding apparatus and its bonding method
AU5752280A (en) Internal clamping device for tubular components
AU549608B2 (en) Measuring the deformation of a material under the influence of heat
CA2062466A1 (en) Method of positioning and fixing optical fibres in a row of optical fibres and a coupling device provided with such a row of fibres
GB2018547B (en) Colour test card facility with adjustable colour temperature for a television camera
NO981895L (en) Method of fitting a contact lens and measuring lens for carrying out the method
EP0326920B1 (en) Device for performing field-assisted ion-exchange in plane-parallel plates
CN209803438U (en) Optical instrument camera lens focus adjustment tool
DE3069083D1 (en) Process for incrementally measuring geometrical dimensions, and devices to perform the process
JPS57147245A (en) Positioning method and device for chip bonding
JPS5635478A (en) Method and apparatus for assembly of solid image pickup device
CN214097635U (en) Wireless charger function test module
JPS57130111A (en) Automatic positioning and adhering device
EP0225625A3 (en) Device for determining positions of light-spots on a plane light sensor
JPS577135A (en) Wire bonding apparatus
ATE124643T1 (en) ROOF TILE TURRET PRESS EQUIPMENT AND METHOD FOR OPERATING THIS EQUIPMENT.
CN113271714A (en) Automatic stripping method and system for PCB protective cover
JPS5432992A (en) Device and method for manufacturing semiconductor device