JPS574116B2 - - Google Patents
Info
- Publication number
- JPS574116B2 JPS574116B2 JP1540675A JP1540675A JPS574116B2 JP S574116 B2 JPS574116 B2 JP S574116B2 JP 1540675 A JP1540675 A JP 1540675A JP 1540675 A JP1540675 A JP 1540675A JP S574116 B2 JPS574116 B2 JP S574116B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1540675A JPS574116B2 (pl) | 1975-02-07 | 1975-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1540675A JPS574116B2 (pl) | 1975-02-07 | 1975-02-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5190475A JPS5190475A (pl) | 1976-08-07 |
| JPS574116B2 true JPS574116B2 (pl) | 1982-01-25 |
Family
ID=11887838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1540675A Expired JPS574116B2 (pl) | 1975-02-07 | 1975-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS574116B2 (pl) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999059386A1 (fr) * | 1998-05-14 | 1999-11-18 | Seiko Epson Corporation | Substrat pour la formation de motifs speciaux et procede de fabrication d'un tel substrat |
| JP2017031441A (ja) * | 2015-07-29 | 2017-02-09 | 日立マクセル株式会社 | メッキ部品の製造方法及びメッキ部品 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08228068A (ja) * | 1995-02-22 | 1996-09-03 | Nec Corp | 無電解めっき用レジスト組成物 |
| JPS59185771A (ja) * | 1983-04-07 | 1984-10-22 | Satoosen:Kk | めつき方法 |
| JPS617691A (ja) * | 1984-06-22 | 1986-01-14 | 日立コンデンサ株式会社 | プリント配線板の製造方法 |
| MY144574A (en) | 1998-09-14 | 2011-10-14 | Ibiden Co Ltd | Printed circuit board and method for its production |
| US20210175079A1 (en) * | 2017-12-06 | 2021-06-10 | Tokyo Electron Limited | Plating method, plating apparatus and recording medium |
-
1975
- 1975-02-07 JP JP1540675A patent/JPS574116B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999059386A1 (fr) * | 1998-05-14 | 1999-11-18 | Seiko Epson Corporation | Substrat pour la formation de motifs speciaux et procede de fabrication d'un tel substrat |
| KR100597015B1 (ko) * | 1998-05-14 | 2006-07-06 | 세이코 엡슨 가부시키가이샤 | 특정 패턴 형성용 기판, 박막 형성 기판 및 기판의 제조 방법 |
| JP2017031441A (ja) * | 2015-07-29 | 2017-02-09 | 日立マクセル株式会社 | メッキ部品の製造方法及びメッキ部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5190475A (pl) | 1976-08-07 |