JPS5739563A - Punching and shaping device for carrier film - Google Patents

Punching and shaping device for carrier film

Info

Publication number
JPS5739563A
JPS5739563A JP55115738A JP11573880A JPS5739563A JP S5739563 A JPS5739563 A JP S5739563A JP 55115738 A JP55115738 A JP 55115738A JP 11573880 A JP11573880 A JP 11573880A JP S5739563 A JPS5739563 A JP S5739563A
Authority
JP
Japan
Prior art keywords
punch
lead
film
bridge
punching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55115738A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258537B2 (enrdf_load_stackoverflow
Inventor
Isamu Inoue
Kouji Katano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP55115738A priority Critical patent/JPS5739563A/ja
Publication of JPS5739563A publication Critical patent/JPS5739563A/ja
Publication of JPS6258537B2 publication Critical patent/JPS6258537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/023—Feeding of components with bending or straightening of the terminal leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
JP55115738A 1980-08-21 1980-08-21 Punching and shaping device for carrier film Granted JPS5739563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55115738A JPS5739563A (en) 1980-08-21 1980-08-21 Punching and shaping device for carrier film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55115738A JPS5739563A (en) 1980-08-21 1980-08-21 Punching and shaping device for carrier film

Publications (2)

Publication Number Publication Date
JPS5739563A true JPS5739563A (en) 1982-03-04
JPS6258537B2 JPS6258537B2 (enrdf_load_stackoverflow) 1987-12-07

Family

ID=14669846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55115738A Granted JPS5739563A (en) 1980-08-21 1980-08-21 Punching and shaping device for carrier film

Country Status (1)

Country Link
JP (1) JPS5739563A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100519969B1 (ko) * 1998-11-06 2005-11-25 삼성전자주식회사 다이/와이어 본딩 장치
KR100575585B1 (ko) * 1998-12-19 2006-10-04 삼성전자주식회사 반도체집적회로소자분리장치
EP3697187A1 (fr) * 2019-02-14 2020-08-19 MGA Technologies Procédé de cambrage des broches électriques de composants

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100519969B1 (ko) * 1998-11-06 2005-11-25 삼성전자주식회사 다이/와이어 본딩 장치
KR100575585B1 (ko) * 1998-12-19 2006-10-04 삼성전자주식회사 반도체집적회로소자분리장치
EP3697187A1 (fr) * 2019-02-14 2020-08-19 MGA Technologies Procédé de cambrage des broches électriques de composants
FR3092956A1 (fr) * 2019-02-14 2020-08-21 Mga Technologies Procede de cambrage des broches electriques de composants

Also Published As

Publication number Publication date
JPS6258537B2 (enrdf_load_stackoverflow) 1987-12-07

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