JPS5738177B2 - - Google Patents

Info

Publication number
JPS5738177B2
JPS5738177B2 JP3411476A JP3411476A JPS5738177B2 JP S5738177 B2 JPS5738177 B2 JP S5738177B2 JP 3411476 A JP3411476 A JP 3411476A JP 3411476 A JP3411476 A JP 3411476A JP S5738177 B2 JPS5738177 B2 JP S5738177B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3411476A
Other languages
Japanese (ja)
Other versions
JPS51121173A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS51121173A publication Critical patent/JPS51121173A/ja
Publication of JPS5738177B2 publication Critical patent/JPS5738177B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP51034114A 1975-03-27 1976-03-26 Method of connecting thinnfilm capacitors made of tantalum or thinnfilm capacitor circuit network to other circuit elements Granted JPS51121173A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2513859A DE2513859C2 (de) 1975-03-27 1975-03-27 Verfahren zum Herstellen eines Kondensator-Widerstands-Netzwerks

Publications (2)

Publication Number Publication Date
JPS51121173A JPS51121173A (en) 1976-10-22
JPS5738177B2 true JPS5738177B2 (OSRAM) 1982-08-13

Family

ID=5942663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51034114A Granted JPS51121173A (en) 1975-03-27 1976-03-26 Method of connecting thinnfilm capacitors made of tantalum or thinnfilm capacitor circuit network to other circuit elements

Country Status (12)

Country Link
US (1) US4227300A (OSRAM)
JP (1) JPS51121173A (OSRAM)
AT (1) AT363568B (OSRAM)
BE (1) BE840073A (OSRAM)
CH (1) CH604354A5 (OSRAM)
DE (1) DE2513859C2 (OSRAM)
DK (1) DK124476A (OSRAM)
FR (1) FR2305837A1 (OSRAM)
GB (1) GB1544505A (OSRAM)
IT (1) IT1058511B (OSRAM)
NL (1) NL7602734A (OSRAM)
SE (1) SE7602901L (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4360960A (en) * 1980-03-11 1982-11-30 Gte Automatic Laboratories, Inc. Method for separating hybrid substrate from carrier plate
US4327472A (en) * 1980-03-11 1982-05-04 Gte Automatic Laboratories, Inc. Method for separating hybrid substrate from carrier plate
DE3139670A1 (de) * 1981-10-06 1983-04-21 Robert Bosch Gmbh, 7000 Stuttgart Elektronische duennschichtschaltung und deren herstellungsverfahren
US5013605A (en) * 1988-08-11 1991-05-07 Gritz David N Cordierite-type glass-ceramic with controlled coloration
JPH0453219A (ja) * 1990-06-20 1992-02-20 Murata Mfg Co Ltd 表面実装型電子部品
RU36580U1 (ru) * 2003-06-30 2004-03-10 Пак Юрий Эдуардович Сетевой фильтр

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD24094A (OSRAM) *
US2756485A (en) * 1950-08-28 1956-07-31 Abramson Moe Process of assembling electrical circuits
DE1097565B (de) * 1956-07-02 1961-01-19 Gen Electric Kondensator zur Verwendung in gedruckten Schaltungsplatten
US3443311A (en) * 1966-10-31 1969-05-13 Bell Telephone Labor Inc Thin film distributed rc network
US3607679A (en) * 1969-05-05 1971-09-21 Bell Telephone Labor Inc Method for the fabrication of discrete rc structure
US3679943A (en) * 1971-04-20 1972-07-25 Du Pont Capacitor assembly having electrode and dielectric layers overlapped for sealing
BE791139A (fr) * 1972-01-14 1973-03-01 Western Electric Co Procede pour le depot de beta-tantale dope par l'azote
JPS4915063U (OSRAM) * 1972-05-15 1974-02-07
DE2228218B1 (de) * 1972-06-09 1973-05-10 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum tauchloeten von traegerplaettchen
US3786323A (en) * 1972-07-03 1974-01-15 Bell Telephone Labor Inc Capacitor with anodized electrode of tantalum silicon alloy

Also Published As

Publication number Publication date
GB1544505A (en) 1979-04-19
FR2305837B1 (OSRAM) 1981-06-26
US4227300A (en) 1980-10-14
IT1058511B (it) 1982-05-10
BE840073A (fr) 1976-09-27
DE2513859A1 (de) 1976-09-30
SE7602901L (sv) 1976-09-28
DK124476A (da) 1976-09-28
DE2513859C2 (de) 1981-11-12
FR2305837A1 (fr) 1976-10-22
ATA94876A (de) 1981-01-15
JPS51121173A (en) 1976-10-22
CH604354A5 (OSRAM) 1978-09-15
AT363568B (de) 1981-08-10
NL7602734A (nl) 1976-09-29

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