FR2305837A1 - Procede pour realiser des contacts electriques pour des condensateurs a couche mince en tantale - Google Patents
Procede pour realiser des contacts electriques pour des condensateurs a couche mince en tantaleInfo
- Publication number
- FR2305837A1 FR2305837A1 FR7608509A FR7608509A FR2305837A1 FR 2305837 A1 FR2305837 A1 FR 2305837A1 FR 7608509 A FR7608509 A FR 7608509A FR 7608509 A FR7608509 A FR 7608509A FR 2305837 A1 FR2305837 A1 FR 2305837A1
- Authority
- FR
- France
- Prior art keywords
- thin film
- electrical contacts
- making electrical
- film capacitors
- tantalum thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title 1
- 229910052715 tantalum Inorganic materials 0.000 title 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2513859A DE2513859C2 (de) | 1975-03-27 | 1975-03-27 | Verfahren zum Herstellen eines Kondensator-Widerstands-Netzwerks |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2305837A1 true FR2305837A1 (fr) | 1976-10-22 |
FR2305837B1 FR2305837B1 (fr) | 1981-06-26 |
Family
ID=5942663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7608509A Granted FR2305837A1 (fr) | 1975-03-27 | 1976-03-24 | Procede pour realiser des contacts electriques pour des condensateurs a couche mince en tantale |
Country Status (12)
Country | Link |
---|---|
US (1) | US4227300A (fr) |
JP (1) | JPS51121173A (fr) |
AT (1) | AT363568B (fr) |
BE (1) | BE840073A (fr) |
CH (1) | CH604354A5 (fr) |
DE (1) | DE2513859C2 (fr) |
DK (1) | DK124476A (fr) |
FR (1) | FR2305837A1 (fr) |
GB (1) | GB1544505A (fr) |
IT (1) | IT1058511B (fr) |
NL (1) | NL7602734A (fr) |
SE (1) | SE7602901L (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1983001344A1 (fr) * | 1981-10-06 | 1983-04-14 | Gruner, Heiko | Circuit electronique a couche mince et son procede de fabrication |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4360960A (en) * | 1980-03-11 | 1982-11-30 | Gte Automatic Laboratories, Inc. | Method for separating hybrid substrate from carrier plate |
US4327472A (en) * | 1980-03-11 | 1982-05-04 | Gte Automatic Laboratories, Inc. | Method for separating hybrid substrate from carrier plate |
US5013605A (en) * | 1988-08-11 | 1991-05-07 | Gritz David N | Cordierite-type glass-ceramic with controlled coloration |
JPH0453219A (ja) * | 1990-06-20 | 1992-02-20 | Murata Mfg Co Ltd | 表面実装型電子部品 |
RU36580U1 (ru) * | 2003-06-30 | 2004-03-10 | Пак Юрий Эдуардович | Сетевой фильтр |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD24094A (fr) * | ||||
US2756485A (en) * | 1950-08-28 | 1956-07-31 | Abramson Moe | Process of assembling electrical circuits |
DE1097565B (de) * | 1956-07-02 | 1961-01-19 | Gen Electric | Kondensator zur Verwendung in gedruckten Schaltungsplatten |
US3443311A (en) * | 1966-10-31 | 1969-05-13 | Bell Telephone Labor Inc | Thin film distributed rc network |
US3607679A (en) * | 1969-05-05 | 1971-09-21 | Bell Telephone Labor Inc | Method for the fabrication of discrete rc structure |
US3679943A (en) * | 1971-04-20 | 1972-07-25 | Du Pont | Capacitor assembly having electrode and dielectric layers overlapped for sealing |
BE791139A (fr) * | 1972-01-14 | 1973-03-01 | Western Electric Co | Procede pour le depot de beta-tantale dope par l'azote |
JPS4915063U (fr) * | 1972-05-15 | 1974-02-07 | ||
DE2228218B1 (de) * | 1972-06-09 | 1973-05-10 | Siemens AG, 1000 Berlin u. 8000 München | Verfahren zum tauchloeten von traegerplaettchen |
US3786323A (en) * | 1972-07-03 | 1974-01-15 | Bell Telephone Labor Inc | Capacitor with anodized electrode of tantalum silicon alloy |
-
1975
- 1975-03-27 DE DE2513859A patent/DE2513859C2/de not_active Expired
-
1976
- 1976-01-27 CH CH96376A patent/CH604354A5/xx not_active IP Right Cessation
- 1976-02-11 AT AT0094876A patent/AT363568B/de not_active IP Right Cessation
- 1976-02-27 SE SE7602901A patent/SE7602901L/xx unknown
- 1976-03-16 GB GB10421/76A patent/GB1544505A/en not_active Expired
- 1976-03-16 NL NL7602734A patent/NL7602734A/xx not_active Application Discontinuation
- 1976-03-22 DK DK124476A patent/DK124476A/da not_active IP Right Cessation
- 1976-03-24 FR FR7608509A patent/FR2305837A1/fr active Granted
- 1976-03-24 IT IT21519/76A patent/IT1058511B/it active
- 1976-03-26 JP JP51034114A patent/JPS51121173A/ja active Granted
- 1976-03-26 BE BE165592A patent/BE840073A/fr not_active IP Right Cessation
-
1978
- 1978-09-18 US US05/943,151 patent/US4227300A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1983001344A1 (fr) * | 1981-10-06 | 1983-04-14 | Gruner, Heiko | Circuit electronique a couche mince et son procede de fabrication |
Also Published As
Publication number | Publication date |
---|---|
GB1544505A (en) | 1979-04-19 |
DE2513859A1 (de) | 1976-09-30 |
DK124476A (da) | 1976-09-28 |
SE7602901L (sv) | 1976-09-28 |
ATA94876A (de) | 1981-01-15 |
AT363568B (de) | 1981-08-10 |
IT1058511B (it) | 1982-05-10 |
US4227300A (en) | 1980-10-14 |
NL7602734A (nl) | 1976-09-29 |
JPS5738177B2 (fr) | 1982-08-13 |
JPS51121173A (en) | 1976-10-22 |
DE2513859C2 (de) | 1981-11-12 |
CH604354A5 (fr) | 1978-09-15 |
BE840073A (fr) | 1976-09-27 |
FR2305837B1 (fr) | 1981-06-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |