JPS5734136A - Polyamide resin molding plated with metal and preparation thereof - Google Patents
Polyamide resin molding plated with metal and preparation thereofInfo
- Publication number
- JPS5734136A JPS5734136A JP10953980A JP10953980A JPS5734136A JP S5734136 A JPS5734136 A JP S5734136A JP 10953980 A JP10953980 A JP 10953980A JP 10953980 A JP10953980 A JP 10953980A JP S5734136 A JPS5734136 A JP S5734136A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide resin
- molding
- plated
- metal
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10953980A JPS6037872B2 (ja) | 1980-08-08 | 1980-08-08 | 金属メツキされたポリアミド樹脂成形物およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10953980A JPS6037872B2 (ja) | 1980-08-08 | 1980-08-08 | 金属メツキされたポリアミド樹脂成形物およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5734136A true JPS5734136A (en) | 1982-02-24 |
JPS6037872B2 JPS6037872B2 (ja) | 1985-08-28 |
Family
ID=14512806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10953980A Expired JPS6037872B2 (ja) | 1980-08-08 | 1980-08-08 | 金属メツキされたポリアミド樹脂成形物およびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6037872B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60155680A (ja) * | 1984-01-26 | 1985-08-15 | Asahi Chem Ind Co Ltd | ポリアミド樹脂成形品のメツキ用前処理方法 |
JPS61270375A (ja) * | 1985-05-24 | 1986-11-29 | Tokai Rika Co Ltd | 成形材料及び成形品へのめつき方法 |
CN110903638A (zh) * | 2019-12-06 | 2020-03-24 | 广东银宝山新科技有限公司 | 可电镀的复合材料及其制备方法和电镀复合材料 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200483313Y1 (ko) * | 2015-12-18 | 2017-04-26 | 한전케이피에스 주식회사 | 발전용 수압 검출 시스템 |
-
1980
- 1980-08-08 JP JP10953980A patent/JPS6037872B2/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60155680A (ja) * | 1984-01-26 | 1985-08-15 | Asahi Chem Ind Co Ltd | ポリアミド樹脂成形品のメツキ用前処理方法 |
JPS61270375A (ja) * | 1985-05-24 | 1986-11-29 | Tokai Rika Co Ltd | 成形材料及び成形品へのめつき方法 |
CN110903638A (zh) * | 2019-12-06 | 2020-03-24 | 广东银宝山新科技有限公司 | 可电镀的复合材料及其制备方法和电镀复合材料 |
Also Published As
Publication number | Publication date |
---|---|
JPS6037872B2 (ja) | 1985-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US2454610A (en) | Method for metalization on nonconductors | |
DE3667182D1 (de) | Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung. | |
WO1991002110A1 (en) | Treatment to reduce solder plating whisker formation | |
JPS5734136A (en) | Polyamide resin molding plated with metal and preparation thereof | |
EP0259011A2 (en) | Method of surface treating a moulded polyacetal resin product | |
AU571392B2 (en) | Aqueous flux for hot dip metallizing process | |
DE69700420D1 (de) | Verfahren zur Bearbeitung der aus Kupfer oder Kupferlegierung hergestellten Aussenoberfläche einer Stranggusskokille welches aus einer Nickelplattierungstufe und einer Nickelentfernungstufe besteht | |
US3736157A (en) | Electroless copper tin plating solution and process | |
DE69603799D1 (de) | Elektrolytisches Verfahren zur Beschichtung eines Metallelements mit Messing | |
CA2093924A1 (en) | Acid bath for copper plating | |
JPS5798529A (en) | Metal plating on polyamide resin | |
JPS56129232A (en) | Metal plating of polyamide resin | |
JPS57100139A (en) | Metallizing of polyamide resin | |
GB1072352A (en) | Process for electroplating on aluminium or on alloy thereof | |
Jawitz et al. | Operation of Copper Pyrophosphate Circuit-Board Plating Baths at High Additive Concentrations | |
JPS57188664A (en) | Electroless plating method for insulation substrate | |
Mayanna et al. | A brightener system for acid zinc plating | |
Karustis | Palladium Electroplating Bath and Process for Plating | |
JPS6436788A (en) | Pretreatment for plating titanium material with noble metal | |
Knodler | Surface Coating of Eyeglass Frames | |
JPS56135954A (en) | Treatment of outside lead of mold semiconductor device before plating | |
Baziard et al. | Process for Colouring Metal Surfaces of Zinc or Zinc Alloys or of Zinc Plated Surfaces | |
JPS5794599A (en) | Silver plated film and electroplating method | |
Schwarz | Cleaning of Brass and Zinc Alloy Diecastings Before Electroplating | |
Hirth et al. | Defects on Electroplated Components: Zinc Plating |