JPS573234B2 - - Google Patents

Info

Publication number
JPS573234B2
JPS573234B2 JP8964372A JP8964372A JPS573234B2 JP S573234 B2 JPS573234 B2 JP S573234B2 JP 8964372 A JP8964372 A JP 8964372A JP 8964372 A JP8964372 A JP 8964372A JP S573234 B2 JPS573234 B2 JP S573234B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8964372A
Other languages
Japanese (ja)
Other versions
JPS4873762A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4873762A publication Critical patent/JPS4873762A/ja
Publication of JPS573234B2 publication Critical patent/JPS573234B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Adjustable Resistors (AREA)
  • Laminated Bodies (AREA)
JP8964372A 1972-01-04 1972-09-08 Expired JPS573234B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21539572A 1972-01-04 1972-01-04

Publications (2)

Publication Number Publication Date
JPS4873762A JPS4873762A (en) 1973-10-04
JPS573234B2 true JPS573234B2 (en) 1982-01-20

Family

ID=22802825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8964372A Expired JPS573234B2 (en) 1972-01-04 1972-09-08

Country Status (2)

Country Link
JP (1) JPS573234B2 (en)
FR (1) FR2166347A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0545010B2 (en) * 1984-10-20 1993-07-08 Fuji Photo Film Co Ltd
WO2012018091A1 (en) 2010-08-06 2012-02-09 日立化成工業株式会社 Liquid composition, and resistor film, resistor element and circuit board using same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
FR2554046B1 (en) * 1983-10-28 1986-05-09 Gen Electric METAL COVERED LAMINATE AND MANUFACTURING METHOD
JPS6413790A (en) * 1987-07-08 1989-01-18 Koa Corp Copper electrode paste
JP3954958B2 (en) 2002-11-26 2007-08-08 古河テクノリサーチ株式会社 Copper foil with resistive layer and circuit board material with resistive layer
JP4217778B2 (en) 2003-04-11 2009-02-04 古河電気工業株式会社 Conductive substrate with resistance layer, circuit board with resistance layer, and resistance circuit wiring board
JP2006005149A (en) * 2004-06-17 2006-01-05 Furukawa Circuit Foil Kk Conductive substrate and circuit board material with resistive layer
CN107675176B (en) * 2017-08-21 2019-05-17 陕西天元智能再制造股份有限公司 A kind of workpiece surface enhanced processing method that differential arc oxidation is combined with vacuum cladding

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2662957A (en) * 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
FR1366903A (en) * 1963-06-04 1964-07-17 Ass Ouvriers Instr Precision Printed resistors and their manufacturing process
GB1157618A (en) * 1965-09-13 1969-07-09 Engelhard Ind Ltd Laminate for Use in the Production of Printed Electrical Circuit Elements.
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0545010B2 (en) * 1984-10-20 1993-07-08 Fuji Photo Film Co Ltd
WO2012018091A1 (en) 2010-08-06 2012-02-09 日立化成工業株式会社 Liquid composition, and resistor film, resistor element and circuit board using same

Also Published As

Publication number Publication date
FR2166347A1 (en) 1973-08-17
JPS4873762A (en) 1973-10-04
FR2166347B1 (en) 1977-12-30

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