FR2166347B1 - - Google Patents

Info

Publication number
FR2166347B1
FR2166347B1 FR7222332A FR7222332A FR2166347B1 FR 2166347 B1 FR2166347 B1 FR 2166347B1 FR 7222332 A FR7222332 A FR 7222332A FR 7222332 A FR7222332 A FR 7222332A FR 2166347 B1 FR2166347 B1 FR 2166347B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7222332A
Other languages
French (fr)
Other versions
FR2166347A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mica Corp
Original Assignee
Mica Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mica Corp filed Critical Mica Corp
Publication of FR2166347A1 publication Critical patent/FR2166347A1/en
Application granted granted Critical
Publication of FR2166347B1 publication Critical patent/FR2166347B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Adjustable Resistors (AREA)
  • Laminated Bodies (AREA)
FR7222332A 1972-01-04 1972-06-21 Printed circuit laminate - with resistive under-cladding Granted FR2166347A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21539572A 1972-01-04 1972-01-04

Publications (2)

Publication Number Publication Date
FR2166347A1 FR2166347A1 (en) 1973-08-17
FR2166347B1 true FR2166347B1 (en) 1977-12-30

Family

ID=22802825

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7222332A Granted FR2166347A1 (en) 1972-01-04 1972-06-21 Printed circuit laminate - with resistive under-cladding

Country Status (2)

Country Link
JP (1) JPS573234B2 (en)
FR (1) FR2166347A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same
FR2554046B1 (en) * 1983-10-28 1986-05-09 Gen Electric METAL COVERED LAMINATE AND MANUFACTURING METHOD
JPS6199134A (en) * 1984-10-20 1986-05-17 Fuji Photo Film Co Ltd Erasing unit of accumulative fluorescent sheet
JPS6413790A (en) * 1987-07-08 1989-01-18 Koa Corp Copper electrode paste
JP3954958B2 (en) 2002-11-26 2007-08-08 古河テクノリサーチ株式会社 Copper foil with resistive layer and circuit board material with resistive layer
JP4217778B2 (en) 2003-04-11 2009-02-04 古河電気工業株式会社 Conductive substrate with resistance layer, circuit board with resistance layer, and resistance circuit wiring board
JP2006005149A (en) * 2004-06-17 2006-01-05 Furukawa Circuit Foil Kk Conductive substrate and circuit board material with resistive layer
WO2012018091A1 (en) 2010-08-06 2012-02-09 日立化成工業株式会社 Liquid composition, and resistor film, resistor element and circuit board using same
CN107675176B (en) * 2017-08-21 2019-05-17 陕西天元智能再制造股份有限公司 A kind of workpiece surface enhanced processing method that differential arc oxidation is combined with vacuum cladding

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2662957A (en) * 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
FR1366903A (en) * 1963-06-04 1964-07-17 Ass Ouvriers Instr Precision Printed resistors and their manufacturing process
GB1157618A (en) * 1965-09-13 1969-07-09 Engelhard Ind Ltd Laminate for Use in the Production of Printed Electrical Circuit Elements.
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Also Published As

Publication number Publication date
JPS573234B2 (en) 1982-01-20
FR2166347A1 (en) 1973-08-17
JPS4873762A (en) 1973-10-04

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse