FR2166347B1 - - Google Patents

Info

Publication number
FR2166347B1
FR2166347B1 FR7222332A FR7222332A FR2166347B1 FR 2166347 B1 FR2166347 B1 FR 2166347B1 FR 7222332 A FR7222332 A FR 7222332A FR 7222332 A FR7222332 A FR 7222332A FR 2166347 B1 FR2166347 B1 FR 2166347B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7222332A
Other versions
FR2166347A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mica Corp
Original Assignee
Mica Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US21539572A priority Critical
Application filed by Mica Corp filed Critical Mica Corp
Publication of FR2166347A1 publication Critical patent/FR2166347A1/en
Application granted granted Critical
Publication of FR2166347B1 publication Critical patent/FR2166347B1/fr
Application status is Expired legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0315Oxidising metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0361Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0723Electroplating, e.g. finish plating
FR7222332A 1972-01-04 1972-06-21 Expired FR2166347B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US21539572A true 1972-01-04 1972-01-04

Publications (2)

Publication Number Publication Date
FR2166347A1 FR2166347A1 (en) 1973-08-17
FR2166347B1 true FR2166347B1 (en) 1977-12-30

Family

ID=22802825

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7222332A Expired FR2166347B1 (en) 1972-01-04 1972-06-21

Country Status (2)

Country Link
JP (1) JPS573234B2 (en)
FR (1) FR2166347B1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542510B2 (en) * 1977-11-21 1980-10-31
JPS6255713B2 (en) * 1980-04-03 1987-11-20 Furukawa Saakitsuto Fuoiru Kk
FR2554046B1 (en) * 1983-10-28 1986-05-09 Gen Electric Laminate covered with metal and method of manufacture
JPH0545010B2 (en) * 1984-10-20 1993-07-08 Fuji Photo Film Co Ltd
JPS6413790A (en) * 1987-07-08 1989-01-18 Koa Corp Copper electrode paste
JP3954958B2 (en) 2002-11-26 2007-08-08 古河サーキットフォイル株式会社 Copper foil with resistive layer and circuit board material with resistive layer
JP4217778B2 (en) 2003-04-11 2009-02-04 古河電気工業株式会社 Conductive substrate with resistance layer, circuit board with resistance layer, and resistance circuit wiring board
JP2006005149A (en) * 2004-06-17 2006-01-05 Furukawa Circuit Foil Kk Conductive substrate and circuit board material with resistive layer
SG187760A1 (en) 2010-08-06 2013-03-28 Hitachi Chemical Co Ltd Liquid composition, and resistor film, resistor element and circuit board using same
CN107675176B (en) * 2017-08-21 2019-05-17 陕西天元智能再制造股份有限公司 A kind of workpiece surface enhanced processing method that differential arc oxidation is combined with vacuum cladding

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2662957A (en) * 1949-10-29 1953-12-15 Eisler Paul Electrical resistor or semiconductor
FR1366903A (en) * 1963-06-04 1964-07-17 Ass Ouvriers Instr Precision printed resistors and their manufacturing process
GB1157618A (en) * 1965-09-13 1969-07-09 Engelhard Ind Ltd Laminate for Use in the Production of Printed Electrical Circuit Elements.
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same

Also Published As

Publication number Publication date
JPS4873762A (en) 1973-10-04
JPS573234B2 (en) 1982-01-20
FR2166347A1 (en) 1973-08-17

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse