JPS5731299B2 - - Google Patents
Info
- Publication number
- JPS5731299B2 JPS5731299B2 JP11464574A JP11464574A JPS5731299B2 JP S5731299 B2 JPS5731299 B2 JP S5731299B2 JP 11464574 A JP11464574 A JP 11464574A JP 11464574 A JP11464574 A JP 11464574A JP S5731299 B2 JPS5731299 B2 JP S5731299B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49114645A JPS5141961A (en) | 1974-10-07 | 1974-10-07 | Handotai shusekikairosochoriidofureemu |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49114645A JPS5141961A (en) | 1974-10-07 | 1974-10-07 | Handotai shusekikairosochoriidofureemu |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58052102A Division JPS58175852A (ja) | 1983-03-28 | 1983-03-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5141961A JPS5141961A (en) | 1976-04-08 |
| JPS5731299B2 true JPS5731299B2 (enExample) | 1982-07-03 |
Family
ID=14642974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49114645A Granted JPS5141961A (en) | 1974-10-07 | 1974-10-07 | Handotai shusekikairosochoriidofureemu |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5141961A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5817649A (ja) * | 1981-07-24 | 1983-02-01 | Fujitsu Ltd | 電子部品パツケ−ジ |
| JPS58175852A (ja) * | 1983-03-28 | 1983-10-15 | Nec Corp | 半導体装置 |
| JPS61258461A (ja) * | 1986-05-23 | 1986-11-15 | Hitachi Ltd | 電子部品 |
| JPS63111655A (ja) * | 1986-10-30 | 1988-05-16 | Toshiba Corp | 半導体素子用フレ−ムの表面処理方法 |
| JPS63291445A (ja) * | 1987-05-23 | 1988-11-29 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの２色部分メッキ方法 |
-
1974
- 1974-10-07 JP JP49114645A patent/JPS5141961A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5141961A (en) | 1976-04-08 |