JPS5141961A - Handotai shusekikairosochoriidofureemu - Google Patents

Handotai shusekikairosochoriidofureemu

Info

Publication number
JPS5141961A
JPS5141961A JP49114645A JP11464574A JPS5141961A JP S5141961 A JPS5141961 A JP S5141961A JP 49114645 A JP49114645 A JP 49114645A JP 11464574 A JP11464574 A JP 11464574A JP S5141961 A JPS5141961 A JP S5141961A
Authority
JP
Japan
Prior art keywords
shusekikairosochoriidofureemu
handotai
handotai shusekikairosochoriidofureemu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49114645A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5731299B2 (enExample
Inventor
Tomoaki Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP49114645A priority Critical patent/JPS5141961A/ja
Publication of JPS5141961A publication Critical patent/JPS5141961A/ja
Publication of JPS5731299B2 publication Critical patent/JPS5731299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP49114645A 1974-10-07 1974-10-07 Handotai shusekikairosochoriidofureemu Granted JPS5141961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49114645A JPS5141961A (en) 1974-10-07 1974-10-07 Handotai shusekikairosochoriidofureemu

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49114645A JPS5141961A (en) 1974-10-07 1974-10-07 Handotai shusekikairosochoriidofureemu

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58052102A Division JPS58175852A (ja) 1983-03-28 1983-03-28 半導体装置

Publications (2)

Publication Number Publication Date
JPS5141961A true JPS5141961A (en) 1976-04-08
JPS5731299B2 JPS5731299B2 (enExample) 1982-07-03

Family

ID=14642974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49114645A Granted JPS5141961A (en) 1974-10-07 1974-10-07 Handotai shusekikairosochoriidofureemu

Country Status (1)

Country Link
JP (1) JPS5141961A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817649A (ja) * 1981-07-24 1983-02-01 Fujitsu Ltd 電子部品パツケ−ジ
JPS58175852A (ja) * 1983-03-28 1983-10-15 Nec Corp 半導体装置
JPS61258461A (ja) * 1986-05-23 1986-11-15 Hitachi Ltd 電子部品
JPS63111655A (ja) * 1986-10-30 1988-05-16 Toshiba Corp 半導体素子用フレ−ムの表面処理方法
JPS63291445A (ja) * 1987-05-23 1988-11-29 Fuji Plant Kogyo Kk リ−ドフレ−ムへの２色部分メッキ方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817649A (ja) * 1981-07-24 1983-02-01 Fujitsu Ltd 電子部品パツケ−ジ
JPS58175852A (ja) * 1983-03-28 1983-10-15 Nec Corp 半導体装置
JPS61258461A (ja) * 1986-05-23 1986-11-15 Hitachi Ltd 電子部品
JPS63111655A (ja) * 1986-10-30 1988-05-16 Toshiba Corp 半導体素子用フレ−ムの表面処理方法
JPS63291445A (ja) * 1987-05-23 1988-11-29 Fuji Plant Kogyo Kk リ−ドフレ−ムへの２色部分メッキ方法

Also Published As

Publication number Publication date
JPS5731299B2 (enExample) 1982-07-03

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