JPS5730307B2 - - Google Patents
Info
- Publication number
- JPS5730307B2 JPS5730307B2 JP15653176A JP15653176A JPS5730307B2 JP S5730307 B2 JPS5730307 B2 JP S5730307B2 JP 15653176 A JP15653176 A JP 15653176A JP 15653176 A JP15653176 A JP 15653176A JP S5730307 B2 JPS5730307 B2 JP S5730307B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15653176A JPS5381073A (en) | 1976-12-27 | 1976-12-27 | Oroduction of resin seal type semiconductor device and lead frame used the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15653176A JPS5381073A (en) | 1976-12-27 | 1976-12-27 | Oroduction of resin seal type semiconductor device and lead frame used the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56161012A Division JPS57132345A (en) | 1981-10-12 | 1981-10-12 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5381073A JPS5381073A (en) | 1978-07-18 |
| JPS5730307B2 true JPS5730307B2 (en:Method) | 1982-06-28 |
Family
ID=15629818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15653176A Granted JPS5381073A (en) | 1976-12-27 | 1976-12-27 | Oroduction of resin seal type semiconductor device and lead frame used the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5381073A (en:Method) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5521124A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame |
| JPS5587469A (en) * | 1978-12-25 | 1980-07-02 | Fujitsu Ltd | Semiconductor device and its manufacture |
| JPS5632462U (en:Method) * | 1979-08-20 | 1981-03-30 | ||
| JPS59136956A (ja) * | 1983-01-25 | 1984-08-06 | Rohm Co Ltd | 半導体装置 |
| JPS59143334A (ja) * | 1983-02-03 | 1984-08-16 | Rohm Co Ltd | 半導体装置の製造方法 |
| JPS59148354A (ja) * | 1983-02-15 | 1984-08-25 | Internatl Rectifier Corp Japan Ltd | 半導体装置用リ−ドフレ−ム |
| JPS60121751A (ja) * | 1984-07-25 | 1985-06-29 | Hitachi Ltd | 半導体装置の製法 |
| DE3674292D1 (de) * | 1985-07-23 | 1990-10-25 | Fairchild Semiconductor | Verpackungsanordnung fuer halbleiterchip und verfahren zum erleichtern deren pruefung und montage auf ein substrat. |
| JP2522287B2 (ja) * | 1987-02-23 | 1996-08-07 | ソニー株式会社 | 半導体装置 |
| JPS6489354A (en) * | 1987-09-29 | 1989-04-03 | Nec Corp | Flat package |
| JP2504194B2 (ja) * | 1989-06-29 | 1996-06-05 | 日本電気株式会社 | 樹脂封止型半導体装置の製造方法 |
| JPH04127459A (ja) * | 1990-09-18 | 1992-04-28 | Nec Kyushu Ltd | 半導体装置の製造方法 |
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1976
- 1976-12-27 JP JP15653176A patent/JPS5381073A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5381073A (en) | 1978-07-18 |