JPS5728673A - Method and apparatus for soldering printed substrate - Google Patents

Method and apparatus for soldering printed substrate

Info

Publication number
JPS5728673A
JPS5728673A JP10188780A JP10188780A JPS5728673A JP S5728673 A JPS5728673 A JP S5728673A JP 10188780 A JP10188780 A JP 10188780A JP 10188780 A JP10188780 A JP 10188780A JP S5728673 A JPS5728673 A JP S5728673A
Authority
JP
Japan
Prior art keywords
chain
bath
substrate
rollers
condition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10188780A
Other languages
Japanese (ja)
Other versions
JPS608904B2 (en
Inventor
Shin Okuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Original Assignee
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SENJIYU KINZOKU KOGYO KK, Senju Metal Industry Co Ltd filed Critical SENJIYU KINZOKU KOGYO KK
Priority to JP10188780A priority Critical patent/JPS608904B2/en
Publication of JPS5728673A publication Critical patent/JPS5728673A/en
Publication of JPS608904B2 publication Critical patent/JPS608904B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To always adjust the soldering condition of printed substrates to the most suitable condition, by soaking the substrate into a stationary solder bath, while the lowering condition of two lines of conveyor chains which are to be lowered toward the stationary solder bath by two pairs of movable chain rollers, is being adjusted.
CONSTITUTION: Movable chain rollers 5a and 5b are at their highest position and a conveyor chain 3 which transfers a carrier 2 which holds a printed substrate 1, is positioned in parallel to a stationary molten solder bath S(a). When the carrier 2 approaches the bath S and turns on a limit switch installed in the course of its running way, rollers 5a and 5b are lower to locations so that they may proceed at an angle α(b). Then, the chain rollers 5a is lowered further after the soaking of the substrate 1 is started under a condition shown in the diagram b, the substrate 1 is positioned in parallel to the bath S as shown in the diagram c. When the substrate leaves the bath S, the chain roller 5b is lifted up first as shown in the diagram d, and then, the chain 3 leaves at an appropriate angle β. Subsequently, the chain rollers 5a and 5b return to the highest position and the chain 3 is positioned in parallel to the bath S as shown in the dagrams e and a.
COPYRIGHT: (C)1982,JPO&Japio
JP10188780A 1980-07-26 1980-07-26 Printed circuit board soldering method and device Expired JPS608904B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10188780A JPS608904B2 (en) 1980-07-26 1980-07-26 Printed circuit board soldering method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10188780A JPS608904B2 (en) 1980-07-26 1980-07-26 Printed circuit board soldering method and device

Publications (2)

Publication Number Publication Date
JPS5728673A true JPS5728673A (en) 1982-02-16
JPS608904B2 JPS608904B2 (en) 1985-03-06

Family

ID=14312439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10188780A Expired JPS608904B2 (en) 1980-07-26 1980-07-26 Printed circuit board soldering method and device

Country Status (1)

Country Link
JP (1) JPS608904B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512510A (en) * 1982-10-26 1985-04-23 Nihon Den-Nitsu Keiki Co. Ltd. Printed circuit board soldering apparatus
JPS6136362U (en) * 1984-07-31 1986-03-06 千住金属工業株式会社 automatic soldering equipment
JPS6197359U (en) * 1984-11-30 1986-06-23

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02217810A (en) * 1989-02-17 1990-08-30 Fujitsu Ltd Optical coupling method by microlens
JPH0324605U (en) * 1989-07-17 1991-03-14

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512510A (en) * 1982-10-26 1985-04-23 Nihon Den-Nitsu Keiki Co. Ltd. Printed circuit board soldering apparatus
JPS6136362U (en) * 1984-07-31 1986-03-06 千住金属工業株式会社 automatic soldering equipment
JPH0123665Y2 (en) * 1984-07-31 1989-07-19
JPS6197359U (en) * 1984-11-30 1986-06-23
JPH0315255Y2 (en) * 1984-11-30 1991-04-03

Also Published As

Publication number Publication date
JPS608904B2 (en) 1985-03-06

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