JPS5724027B2 - - Google Patents

Info

Publication number
JPS5724027B2
JPS5724027B2 JP10189077A JP10189077A JPS5724027B2 JP S5724027 B2 JPS5724027 B2 JP S5724027B2 JP 10189077 A JP10189077 A JP 10189077A JP 10189077 A JP10189077 A JP 10189077A JP S5724027 B2 JPS5724027 B2 JP S5724027B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10189077A
Other languages
Japanese (ja)
Other versions
JPS5435679A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10189077A priority Critical patent/JPS5435679A/ja
Publication of JPS5435679A publication Critical patent/JPS5435679A/ja
Publication of JPS5724027B2 publication Critical patent/JPS5724027B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP10189077A 1977-08-25 1977-08-25 Semiconductor connection method Granted JPS5435679A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10189077A JPS5435679A (en) 1977-08-25 1977-08-25 Semiconductor connection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10189077A JPS5435679A (en) 1977-08-25 1977-08-25 Semiconductor connection method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58030851A Division JPS593850B2 (ja) 1983-02-28 1983-02-28 半導体ワイヤ−ボンディング装置

Publications (2)

Publication Number Publication Date
JPS5435679A JPS5435679A (en) 1979-03-15
JPS5724027B2 true JPS5724027B2 (ca) 1982-05-21

Family

ID=14312515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10189077A Granted JPS5435679A (en) 1977-08-25 1977-08-25 Semiconductor connection method

Country Status (1)

Country Link
JP (1) JPS5435679A (ca)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0180321U (ca) * 1987-11-16 1989-05-30

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127031A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Wire bonding
JPS55132049A (en) * 1979-03-30 1980-10-14 Nec Corp Method and device for wire bonding
JPS55156334A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Wire bonding method and apparatus thereof
JPS55166934A (en) * 1979-06-15 1980-12-26 Hitachi Ltd Automatic wire bonding method
JPS5630785A (en) * 1979-08-21 1981-03-27 Nippon Electric Co Method of forming electrode on ceramic crude sheet
JPS5785290A (en) * 1980-11-17 1982-05-27 Fujitsu Ltd Method of producing ceramic printed board
JPS61179548A (ja) * 1986-02-07 1986-08-12 Hitachi Ltd ワイヤボンデイング装置
DE112017001742T5 (de) 2016-03-29 2018-12-27 Life Robotics Inc. Torsionsgelenkmechanismus, Roboterarmmechanismus und freitragender Drehmechanismus
WO2017170306A1 (ja) 2016-03-29 2017-10-05 ライフロボティクス株式会社 直動伸縮機構及びロボットアーム機構
DE112017001677T5 (de) 2016-03-29 2018-12-13 Life Robotics Inc. Näherungssensorvorrichtung und Roboterarmmechanismus
DE112017001656B4 (de) 2016-03-29 2022-12-22 Life Robotics Inc. Roboterarmmechanismus und Drehgelenkvorrichtung
CN108884919A (zh) 2016-03-29 2018-11-23 生活机器人学股份有限公司 直动伸缩机构及机械臂机构
CN109153133B (zh) 2016-05-31 2022-04-05 生活机器人学股份有限公司 直动伸缩机构
DE112017003832B4 (de) 2016-07-30 2023-05-17 Life Robotics Inc. Roboterarmmechanismus
DE112017005497T5 (de) 2016-10-31 2019-08-08 Life Robotics Inc. Näherungssensorvorrichtung und roboterarmmechanismus
JPWO2018079772A1 (ja) 2016-10-31 2019-10-03 ライフロボティクス株式会社 ロボットアーム機構

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0180321U (ca) * 1987-11-16 1989-05-30

Also Published As

Publication number Publication date
JPS5435679A (en) 1979-03-15

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