JPS5723668A - Adhesion method - Google Patents
Adhesion methodInfo
- Publication number
- JPS5723668A JPS5723668A JP9858780A JP9858780A JPS5723668A JP S5723668 A JPS5723668 A JP S5723668A JP 9858780 A JP9858780 A JP 9858780A JP 9858780 A JP9858780 A JP 9858780A JP S5723668 A JPS5723668 A JP S5723668A
- Authority
- JP
- Japan
- Prior art keywords
- film
- thin film
- base plate
- low
- indium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: A part porvided with a thin film of low-melting metal is brought into contact with another part provided with a thin film of metal which causes solid- phase reaction with the low-melting metal at low temperature and they are pressed, then laser beams are irradiated to effect adhesion with high performance readily without exposure of the substrate to high temperature.
CONSTITUTION: For example, an indium film 3 is formed by metallization on the base plate 1 of glass or crystal of glass derivative. At this time, when necessary, a chromium thin film is previously formed to increase the adhesion of the indium film 3 to the base plate 1. On the surface of the base plate 2, is formed a thin film of chromium 5 and gold is metallized thereon. These thin films are brought into contact with each other in the air at room temperature and a light weight is loaded. Pulse laser beams are focussed through lens 7 on the metallized films and the indium film 3 reacts with the gold film 4 in solid phase to form an alloy.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9858780A JPS5723668A (en) | 1980-07-18 | 1980-07-18 | Adhesion method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9858780A JPS5723668A (en) | 1980-07-18 | 1980-07-18 | Adhesion method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5723668A true JPS5723668A (en) | 1982-02-06 |
JPS6347758B2 JPS6347758B2 (en) | 1988-09-26 |
Family
ID=14223771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9858780A Granted JPS5723668A (en) | 1980-07-18 | 1980-07-18 | Adhesion method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5723668A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517038A (en) * | 1978-07-20 | 1980-02-06 | Matsushita Electric Ind Co Ltd | Kerosene carburator |
JPS6363773A (en) * | 1986-09-04 | 1988-03-22 | Nippon Telegr & Teleph Corp <Ntt> | Bonding method |
JP2002180014A (en) * | 2000-12-12 | 2002-06-26 | Ngk Insulators Ltd | Method for producing bonded body, bonded body and adhesive |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4991937A (en) * | 1972-12-27 | 1974-09-03 |
-
1980
- 1980-07-18 JP JP9858780A patent/JPS5723668A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4991937A (en) * | 1972-12-27 | 1974-09-03 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517038A (en) * | 1978-07-20 | 1980-02-06 | Matsushita Electric Ind Co Ltd | Kerosene carburator |
JPS6363773A (en) * | 1986-09-04 | 1988-03-22 | Nippon Telegr & Teleph Corp <Ntt> | Bonding method |
JP2002180014A (en) * | 2000-12-12 | 2002-06-26 | Ngk Insulators Ltd | Method for producing bonded body, bonded body and adhesive |
JP4698018B2 (en) * | 2000-12-12 | 2011-06-08 | 日本碍子株式会社 | Adhesive manufacturing method and adhesive |
Also Published As
Publication number | Publication date |
---|---|
JPS6347758B2 (en) | 1988-09-26 |
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