JPS5722231B2 - - Google Patents
Info
- Publication number
- JPS5722231B2 JPS5722231B2 JP14340774A JP14340774A JPS5722231B2 JP S5722231 B2 JPS5722231 B2 JP S5722231B2 JP 14340774 A JP14340774 A JP 14340774A JP 14340774 A JP14340774 A JP 14340774A JP S5722231 B2 JPS5722231 B2 JP S5722231B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14340774A JPS5722231B2 (ja) | 1974-12-16 | 1974-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14340774A JPS5722231B2 (ja) | 1974-12-16 | 1974-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5169991A JPS5169991A (ja) | 1976-06-17 |
| JPS5722231B2 true JPS5722231B2 (ja) | 1982-05-12 |
Family
ID=15338042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14340774A Expired JPS5722231B2 (ja) | 1974-12-16 | 1974-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5722231B2 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57178387A (en) * | 1981-04-28 | 1982-11-02 | Matsushita Electric Ind Co Ltd | Indicator for luminescence and its manufacture |
| JPS608049U (ja) * | 1983-06-27 | 1985-01-21 | 株式会社リコー | Ｌｅｄアレイ光源 |
| JPH10294493A (ja) * | 1997-02-21 | 1998-11-04 | Toshiba Corp | 半導体発光デバイス |
| CN104227139A (zh) * | 2014-08-29 | 2014-12-24 | 常州宏力称重设备制造有限公司 | 紧固锉刀 |
-
1974
- 1974-12-16 JP JP14340774A patent/JPS5722231B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5169991A (ja) | 1976-06-17 |