JPS57211707A - Thick film coil - Google Patents

Thick film coil

Info

Publication number
JPS57211707A
JPS57211707A JP9670681A JP9670681A JPS57211707A JP S57211707 A JPS57211707 A JP S57211707A JP 9670681 A JP9670681 A JP 9670681A JP 9670681 A JP9670681 A JP 9670681A JP S57211707 A JPS57211707 A JP S57211707A
Authority
JP
Japan
Prior art keywords
spiral
coil forming
cutting
forming electrode
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9670681A
Other languages
Japanese (ja)
Inventor
Masaki Kamiakutsu
Koichi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9670681A priority Critical patent/JPS57211707A/en
Publication of JPS57211707A publication Critical patent/JPS57211707A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances

Abstract

PURPOSE:To allow automatic adjustment by machines, by removing a coil forming electrode in a spiral form by cutting to adjust the inductance using a removal amount by cutting. CONSTITUTION:A lead-out electrode 14 is formed on a substrate 6 next to form an insulator 10. Next, the coil forming electrode is superposed thereon. This coil forming electrode and lead-out electrode 14 are connected at a connection part 9 at the center of the insulator 10. The coil forming electrode is removed by cutting in a spiral form from the outer boundary to form a spiral adjustment groove 12 for a spiral coil 13. The spiral adjustment groove 12 is formed until the inductance reaches a fixed value.
JP9670681A 1981-06-24 1981-06-24 Thick film coil Pending JPS57211707A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9670681A JPS57211707A (en) 1981-06-24 1981-06-24 Thick film coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9670681A JPS57211707A (en) 1981-06-24 1981-06-24 Thick film coil

Publications (1)

Publication Number Publication Date
JPS57211707A true JPS57211707A (en) 1982-12-25

Family

ID=14172192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9670681A Pending JPS57211707A (en) 1981-06-24 1981-06-24 Thick film coil

Country Status (1)

Country Link
JP (1) JPS57211707A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007235034A (en) * 2006-03-03 2007-09-13 Seiko Epson Corp Electronic substrate, semiconductor device, and electronic equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619613A (en) * 1979-07-25 1981-02-24 Mitsubishi Electric Corp Manufacture of inductance element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619613A (en) * 1979-07-25 1981-02-24 Mitsubishi Electric Corp Manufacture of inductance element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007235034A (en) * 2006-03-03 2007-09-13 Seiko Epson Corp Electronic substrate, semiconductor device, and electronic equipment
US7746232B2 (en) 2006-03-03 2010-06-29 Seiko Epson Corporation Electronic substrate, semiconductor device, and electronic device
JP4544181B2 (en) * 2006-03-03 2010-09-15 セイコーエプソン株式会社 Electronic substrate, semiconductor device and electronic equipment
US8610578B2 (en) 2006-03-03 2013-12-17 Seiko Epson Corporation Electronic substrate, semiconductor device, and electronic device
US9251942B2 (en) 2006-03-03 2016-02-02 Seiko Epson Corporation Electronic substrate, semiconductor device, and electronic device

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