JPS57208146A - Forming method for insulating film to compound semiconductor - Google Patents

Forming method for insulating film to compound semiconductor

Info

Publication number
JPS57208146A
JPS57208146A JP9314781A JP9314781A JPS57208146A JP S57208146 A JPS57208146 A JP S57208146A JP 9314781 A JP9314781 A JP 9314781A JP 9314781 A JP9314781 A JP 9314781A JP S57208146 A JPS57208146 A JP S57208146A
Authority
JP
Japan
Prior art keywords
substrate
infrared ray
insulating film
compound semiconductor
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9314781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6313340B2 (enrdf_load_stackoverflow
Inventor
Kazutaka Kamitake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9314781A priority Critical patent/JPS57208146A/ja
Publication of JPS57208146A publication Critical patent/JPS57208146A/ja
Publication of JPS6313340B2 publication Critical patent/JPS6313340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP9314781A 1981-06-17 1981-06-17 Forming method for insulating film to compound semiconductor Granted JPS57208146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9314781A JPS57208146A (en) 1981-06-17 1981-06-17 Forming method for insulating film to compound semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9314781A JPS57208146A (en) 1981-06-17 1981-06-17 Forming method for insulating film to compound semiconductor

Publications (2)

Publication Number Publication Date
JPS57208146A true JPS57208146A (en) 1982-12-21
JPS6313340B2 JPS6313340B2 (enrdf_load_stackoverflow) 1988-03-25

Family

ID=14074415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9314781A Granted JPS57208146A (en) 1981-06-17 1981-06-17 Forming method for insulating film to compound semiconductor

Country Status (1)

Country Link
JP (1) JPS57208146A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4560420A (en) * 1984-06-13 1985-12-24 At&T Technologies, Inc. Method for reducing temperature variations across a semiconductor wafer during heating
US6594446B2 (en) 2000-12-04 2003-07-15 Vortek Industries Ltd. Heat-treating methods and systems
US7445382B2 (en) 2001-12-26 2008-11-04 Mattson Technology Canada, Inc. Temperature measurement and heat-treating methods and system
US7501607B2 (en) 2003-12-19 2009-03-10 Mattson Technology Canada, Inc. Apparatuses and methods for suppressing thermally-induced motion of a workpiece
US9070590B2 (en) 2008-05-16 2015-06-30 Mattson Technology, Inc. Workpiece breakage prevention method and apparatus
US9627244B2 (en) 2002-12-20 2017-04-18 Mattson Technology, Inc. Methods and systems for supporting a workpiece and for heat-treating the workpiece

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4560420A (en) * 1984-06-13 1985-12-24 At&T Technologies, Inc. Method for reducing temperature variations across a semiconductor wafer during heating
US6594446B2 (en) 2000-12-04 2003-07-15 Vortek Industries Ltd. Heat-treating methods and systems
US6941063B2 (en) 2000-12-04 2005-09-06 Mattson Technology Canada, Inc. Heat-treating methods and systems
US6963692B2 (en) 2000-12-04 2005-11-08 Vortek Industries Ltd. Heat-treating methods and systems
US7445382B2 (en) 2001-12-26 2008-11-04 Mattson Technology Canada, Inc. Temperature measurement and heat-treating methods and system
US7616872B2 (en) 2001-12-26 2009-11-10 Mattson Technology Canada, Inc. Temperature measurement and heat-treating methods and systems
US9627244B2 (en) 2002-12-20 2017-04-18 Mattson Technology, Inc. Methods and systems for supporting a workpiece and for heat-treating the workpiece
US7501607B2 (en) 2003-12-19 2009-03-10 Mattson Technology Canada, Inc. Apparatuses and methods for suppressing thermally-induced motion of a workpiece
US9070590B2 (en) 2008-05-16 2015-06-30 Mattson Technology, Inc. Workpiece breakage prevention method and apparatus

Also Published As

Publication number Publication date
JPS6313340B2 (enrdf_load_stackoverflow) 1988-03-25

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