JPS57202727A - Method and device for heat treatment - Google Patents

Method and device for heat treatment

Info

Publication number
JPS57202727A
JPS57202727A JP8839681A JP8839681A JPS57202727A JP S57202727 A JPS57202727 A JP S57202727A JP 8839681 A JP8839681 A JP 8839681A JP 8839681 A JP8839681 A JP 8839681A JP S57202727 A JPS57202727 A JP S57202727A
Authority
JP
Japan
Prior art keywords
core tube
substrate
tube
heat treatment
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8839681A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6227724B2 (enrdf_load_stackoverflow
Inventor
Keiichi Kagawa
Kiyohiro Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8839681A priority Critical patent/JPS57202727A/ja
Publication of JPS57202727A publication Critical patent/JPS57202727A/ja
Publication of JPS6227724B2 publication Critical patent/JPS6227724B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP8839681A 1981-06-09 1981-06-09 Method and device for heat treatment Granted JPS57202727A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8839681A JPS57202727A (en) 1981-06-09 1981-06-09 Method and device for heat treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8839681A JPS57202727A (en) 1981-06-09 1981-06-09 Method and device for heat treatment

Publications (2)

Publication Number Publication Date
JPS57202727A true JPS57202727A (en) 1982-12-11
JPS6227724B2 JPS6227724B2 (enrdf_load_stackoverflow) 1987-06-16

Family

ID=13941627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8839681A Granted JPS57202727A (en) 1981-06-09 1981-06-09 Method and device for heat treatment

Country Status (1)

Country Link
JP (1) JPS57202727A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161711A (ja) * 1985-01-11 1986-07-22 Denkoo:Kk 半導体の熱処理方法及び熱処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353965U (enrdf_load_stackoverflow) * 1976-10-08 1978-05-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353965U (enrdf_load_stackoverflow) * 1976-10-08 1978-05-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161711A (ja) * 1985-01-11 1986-07-22 Denkoo:Kk 半導体の熱処理方法及び熱処理装置

Also Published As

Publication number Publication date
JPS6227724B2 (enrdf_load_stackoverflow) 1987-06-16

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