JPS57201031A - Forming method of protective film on surface of pellet - Google Patents
Forming method of protective film on surface of pelletInfo
- Publication number
- JPS57201031A JPS57201031A JP56086222A JP8622281A JPS57201031A JP S57201031 A JPS57201031 A JP S57201031A JP 56086222 A JP56086222 A JP 56086222A JP 8622281 A JP8622281 A JP 8622281A JP S57201031 A JPS57201031 A JP S57201031A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- film
- wire
- aluminum
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
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- H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
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- H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
- H01L2224/487—Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/48717—Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01013—Aluminum [Al]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Local Oxidation Of Silicon (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To obtain a protective layer by converting the surface of an aluminum wiring layer into an oxide after completing the bonding. CONSTITUTION:An oxidized film 15 is formed on a semiconductor pellet 14, a desired hole is opened at the film 15, and a wire 11 of aluminum connected to a circuit element in the pellet 14 is pulled above the film 15 through the hole. A metal wire 16 is bonded to the wire 11 of aluminum in this state. Thereafer, it is heat treated in oxidative atmosphere such as steam or ozone to convert it into oxidized aluminum 9 with the surface of the wire 11 as a protective film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56086222A JPS57201031A (en) | 1981-06-04 | 1981-06-04 | Forming method of protective film on surface of pellet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56086222A JPS57201031A (en) | 1981-06-04 | 1981-06-04 | Forming method of protective film on surface of pellet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57201031A true JPS57201031A (en) | 1982-12-09 |
Family
ID=13880750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56086222A Pending JPS57201031A (en) | 1981-06-04 | 1981-06-04 | Forming method of protective film on surface of pellet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57201031A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5565378A (en) * | 1992-02-17 | 1996-10-15 | Mitsubishi Denki Kabushiki Kaisha | Process of passivating a semiconductor device bonding pad by immersion in O2 or O3 solution |
-
1981
- 1981-06-04 JP JP56086222A patent/JPS57201031A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5565378A (en) * | 1992-02-17 | 1996-10-15 | Mitsubishi Denki Kabushiki Kaisha | Process of passivating a semiconductor device bonding pad by immersion in O2 or O3 solution |
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