JPS57192424A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS57192424A
JPS57192424A JP56076612A JP7661281A JPS57192424A JP S57192424 A JPS57192424 A JP S57192424A JP 56076612 A JP56076612 A JP 56076612A JP 7661281 A JP7661281 A JP 7661281A JP S57192424 A JPS57192424 A JP S57192424A
Authority
JP
Japan
Prior art keywords
compound
resin composition
thermosetting resin
polysulfide
polyisocyanate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56076612A
Other languages
Japanese (ja)
Other versions
JPS6330924B2 (en
Inventor
Akio Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56076612A priority Critical patent/JPS57192424A/en
Publication of JPS57192424A publication Critical patent/JPS57192424A/en
Publication of JPS6330924B2 publication Critical patent/JPS6330924B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Polyurethanes Or Polyureas (AREA)

Abstract

PURPOSE: An epoxy resin composition having excellent adhesion and cohesion, a low modulus of elasticity and a low coefficient of expansion and a high glass transition point, comprising a polyepoxy compound, a polyisocyanate and a polysulfide compound.
CONSTITUTION: A thermosetting resin composition comprising a polyepoxy compound, a polyisocyanate compound and a polysulfide compound. As the polyepoxy compound, there can be mentioned a diepoxide such as diglycidyl ether of bisphenol A or butadiene diepoxide or a tri- or higher epoxide such as triglyceryl ether of glycerol or triglycidyl ether of trimethylolpropane. As the polysulfide compound, there is preferably used a polymer having a MW of about 500W10,000.
COPYRIGHT: (C)1982,JPO&Japio
JP56076612A 1981-05-22 1981-05-22 Thermosetting resin composition Granted JPS57192424A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56076612A JPS57192424A (en) 1981-05-22 1981-05-22 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56076612A JPS57192424A (en) 1981-05-22 1981-05-22 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS57192424A true JPS57192424A (en) 1982-11-26
JPS6330924B2 JPS6330924B2 (en) 1988-06-21

Family

ID=13610158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56076612A Granted JPS57192424A (en) 1981-05-22 1981-05-22 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS57192424A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49133432A (en) * 1972-09-18 1974-12-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49133432A (en) * 1972-09-18 1974-12-21

Also Published As

Publication number Publication date
JPS6330924B2 (en) 1988-06-21

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