JPS57192038A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPS57192038A
JPS57192038A JP56076113A JP7611381A JPS57192038A JP S57192038 A JPS57192038 A JP S57192038A JP 56076113 A JP56076113 A JP 56076113A JP 7611381 A JP7611381 A JP 7611381A JP S57192038 A JPS57192038 A JP S57192038A
Authority
JP
Japan
Prior art keywords
bonding
magazine
encasing
lead frames
moved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56076113A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6332254B2 (cg-RX-API-DMAC10.html
Inventor
Yoshihiro Kazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56076113A priority Critical patent/JPS57192038A/ja
Publication of JPS57192038A publication Critical patent/JPS57192038A/ja
Publication of JPS6332254B2 publication Critical patent/JPS6332254B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0198—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/737—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP56076113A 1981-05-20 1981-05-20 Bonding device Granted JPS57192038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56076113A JPS57192038A (en) 1981-05-20 1981-05-20 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56076113A JPS57192038A (en) 1981-05-20 1981-05-20 Bonding device

Publications (2)

Publication Number Publication Date
JPS57192038A true JPS57192038A (en) 1982-11-26
JPS6332254B2 JPS6332254B2 (cg-RX-API-DMAC10.html) 1988-06-29

Family

ID=13595837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56076113A Granted JPS57192038A (en) 1981-05-20 1981-05-20 Bonding device

Country Status (1)

Country Link
JP (1) JPS57192038A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01148912U (cg-RX-API-DMAC10.html) * 1988-04-05 1989-10-16

Also Published As

Publication number Publication date
JPS6332254B2 (cg-RX-API-DMAC10.html) 1988-06-29

Similar Documents

Publication Publication Date Title
LV10225A (lv) Lifta durvju piedzinas ierice ar blokesanas
GB2158643B (en) Wire bonding method
DE3483997D1 (de) Kassettenladevorrichtung.
ATE80962T1 (de) Kassettenladegeraet und arbeitsverfahren.
JPS57192038A (en) Bonding device
KR880013244A (ko) Ic(집적회로)장치의 리이드 와이어의 본딩방법 및 장치
ATA226387A (de) Oeffnungsvorrichtung zum oeffnen von gepressten faserballen
ATE83954T1 (de) Einrichtung zum fuehren von zargen fuer einen unrunden querschnitt aufweisende dosen.
ATE39138T1 (de) Arbeitsstueckfuehrungseinrichtung an naehmaschinen.
GB1549482A (en) Automatic guiding device for the workpiece on a sewing machine
DE3765391D1 (de) Einrichtung zum fuehren eines fadens.
JPS57124446A (en) Die bond apparatus
DE3872387D1 (de) Geraet zum erfassen einer garnbewegung.
JPS56142646A (en) Wire bonding method
JPS57168309A (en) Goods positioning mechanism
EP0104955A3 (en) Apparatus for and method of drawing wire
JPS5718330A (en) Method of and apparatus for soldering semiconductor device
JPS6429790A (en) Inspecting device for parts packed on substrate
JPS5683042A (en) Wire clamping system of wire bonder
JPH0254664B2 (cg-RX-API-DMAC10.html)
JPS5743882A (en) Heat-sensitive recorder
JPS56162847A (en) Mounting method for bonding wire
JPS57176737A (en) Bonding error detector for wire bonder
IT8423240A1 (it) Dispositivo per il controllo e l'arresto di una macchina cucitrice automatica particolarmente una macchina trapuntatrice multiaghi
JPS6466572A (en) Apparatus for inspecting ic package