JPS57191045U - - Google Patents
Info
- Publication number
- JPS57191045U JPS57191045U JP1981078209U JP7820981U JPS57191045U JP S57191045 U JPS57191045 U JP S57191045U JP 1981078209 U JP1981078209 U JP 1981078209U JP 7820981 U JP7820981 U JP 7820981U JP S57191045 U JPS57191045 U JP S57191045U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981078209U JPS6334269Y2 (https=) | 1981-05-28 | 1981-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981078209U JPS6334269Y2 (https=) | 1981-05-28 | 1981-05-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57191045U true JPS57191045U (https=) | 1982-12-03 |
| JPS6334269Y2 JPS6334269Y2 (https=) | 1988-09-12 |
Family
ID=29873850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981078209U Expired JPS6334269Y2 (https=) | 1981-05-28 | 1981-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6334269Y2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59106124A (ja) * | 1982-12-11 | 1984-06-19 | Toshiba Corp | 半導体装置の製造方法及びその製造装置 |
| JP2014014868A (ja) * | 2012-07-05 | 2014-01-30 | Vesi Switzerland Ag | フラックスフリーのハンダを基板に供給する方法および装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5123759A (en) * | 1974-08-22 | 1976-02-25 | Asahi Glass Co Ltd | Ekishohyojisoshino fushihoho |
| JPS5582445A (en) * | 1978-12-18 | 1980-06-21 | Matsushita Electronics Corp | Method of bonding semiconductor substrate |
-
1981
- 1981-05-28 JP JP1981078209U patent/JPS6334269Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5123759A (en) * | 1974-08-22 | 1976-02-25 | Asahi Glass Co Ltd | Ekishohyojisoshino fushihoho |
| JPS5582445A (en) * | 1978-12-18 | 1980-06-21 | Matsushita Electronics Corp | Method of bonding semiconductor substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59106124A (ja) * | 1982-12-11 | 1984-06-19 | Toshiba Corp | 半導体装置の製造方法及びその製造装置 |
| JP2014014868A (ja) * | 2012-07-05 | 2014-01-30 | Vesi Switzerland Ag | フラックスフリーのハンダを基板に供給する方法および装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6334269Y2 (https=) | 1988-09-12 |