JPS57191045U - - Google Patents

Info

Publication number
JPS57191045U
JPS57191045U JP1981078209U JP7820981U JPS57191045U JP S57191045 U JPS57191045 U JP S57191045U JP 1981078209 U JP1981078209 U JP 1981078209U JP 7820981 U JP7820981 U JP 7820981U JP S57191045 U JPS57191045 U JP S57191045U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981078209U
Other languages
Japanese (ja)
Other versions
JPS6334269Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981078209U priority Critical patent/JPS6334269Y2/ja
Publication of JPS57191045U publication Critical patent/JPS57191045U/ja
Application granted granted Critical
Publication of JPS6334269Y2 publication Critical patent/JPS6334269Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1981078209U 1981-05-28 1981-05-28 Expired JPS6334269Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981078209U JPS6334269Y2 (enrdf_load_stackoverflow) 1981-05-28 1981-05-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981078209U JPS6334269Y2 (enrdf_load_stackoverflow) 1981-05-28 1981-05-28

Publications (2)

Publication Number Publication Date
JPS57191045U true JPS57191045U (enrdf_load_stackoverflow) 1982-12-03
JPS6334269Y2 JPS6334269Y2 (enrdf_load_stackoverflow) 1988-09-12

Family

ID=29873850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981078209U Expired JPS6334269Y2 (enrdf_load_stackoverflow) 1981-05-28 1981-05-28

Country Status (1)

Country Link
JP (1) JPS6334269Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59106124A (ja) * 1982-12-11 1984-06-19 Toshiba Corp 半導体装置の製造方法及びその製造装置
JP2014014868A (ja) * 2012-07-05 2014-01-30 Vesi Switzerland Ag フラックスフリーのハンダを基板に供給する方法および装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123759A (en) * 1974-08-22 1976-02-25 Asahi Glass Co Ltd Ekishohyojisoshino fushihoho
JPS5582445A (en) * 1978-12-18 1980-06-21 Matsushita Electronics Corp Method of bonding semiconductor substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123759A (en) * 1974-08-22 1976-02-25 Asahi Glass Co Ltd Ekishohyojisoshino fushihoho
JPS5582445A (en) * 1978-12-18 1980-06-21 Matsushita Electronics Corp Method of bonding semiconductor substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59106124A (ja) * 1982-12-11 1984-06-19 Toshiba Corp 半導体装置の製造方法及びその製造装置
JP2014014868A (ja) * 2012-07-05 2014-01-30 Vesi Switzerland Ag フラックスフリーのハンダを基板に供給する方法および装置

Also Published As

Publication number Publication date
JPS6334269Y2 (enrdf_load_stackoverflow) 1988-09-12

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