JPS571902A - Method and apparatus for measuring wafer thickness for wafer lapping machine - Google Patents
Method and apparatus for measuring wafer thickness for wafer lapping machineInfo
- Publication number
- JPS571902A JPS571902A JP7554580A JP7554580A JPS571902A JP S571902 A JPS571902 A JP S571902A JP 7554580 A JP7554580 A JP 7554580A JP 7554580 A JP7554580 A JP 7554580A JP S571902 A JPS571902 A JP S571902A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- surface plate
- lapping
- carrier
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/0002—Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7554580A JPS571902A (en) | 1980-06-06 | 1980-06-06 | Method and apparatus for measuring wafer thickness for wafer lapping machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7554580A JPS571902A (en) | 1980-06-06 | 1980-06-06 | Method and apparatus for measuring wafer thickness for wafer lapping machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS571902A true JPS571902A (en) | 1982-01-07 |
Family
ID=13579272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7554580A Pending JPS571902A (en) | 1980-06-06 | 1980-06-06 | Method and apparatus for measuring wafer thickness for wafer lapping machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS571902A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02257628A (ja) * | 1989-03-30 | 1990-10-18 | Kyushu Electron Metal Co Ltd | 半導体基板の研磨方法及びその装置 |
US6168499B1 (en) | 1998-05-26 | 2001-01-02 | Samsung Electronics Co., Ltd. | Grinding apparatus for semiconductor wafers |
JP2013184277A (ja) * | 2012-03-09 | 2013-09-19 | Disco Corp | バイト切削装置 |
CN113932682A (zh) * | 2021-09-06 | 2022-01-14 | 苏州东大工程咨询管理有限公司 | 道路工程监理用混凝土层厚度检测装置及其实施方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5239889A (en) * | 1975-09-23 | 1977-03-28 | Tousei Eng Service:Kk | Method for measuring dimensions of lapping |
-
1980
- 1980-06-06 JP JP7554580A patent/JPS571902A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5239889A (en) * | 1975-09-23 | 1977-03-28 | Tousei Eng Service:Kk | Method for measuring dimensions of lapping |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02257628A (ja) * | 1989-03-30 | 1990-10-18 | Kyushu Electron Metal Co Ltd | 半導体基板の研磨方法及びその装置 |
US6168499B1 (en) | 1998-05-26 | 2001-01-02 | Samsung Electronics Co., Ltd. | Grinding apparatus for semiconductor wafers |
JP2013184277A (ja) * | 2012-03-09 | 2013-09-19 | Disco Corp | バイト切削装置 |
CN113932682A (zh) * | 2021-09-06 | 2022-01-14 | 苏州东大工程咨询管理有限公司 | 道路工程监理用混凝土层厚度检测装置及其实施方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960012623B1 (ko) | 부착판 세정장치 | |
DE2965006D1 (en) | Method for the selective detection of defects, caused by polishing, on the surface of silicon wafers | |
JPS571902A (en) | Method and apparatus for measuring wafer thickness for wafer lapping machine | |
JPS5745232A (en) | Device and method for developing | |
CN110530317A (zh) | 一种检测装置 | |
JP4024961B2 (ja) | 研削装置における研削ユニットの原点位置セットアップ方法 | |
JPS5617709A (en) | Tire loading device for uniformity machine | |
CN116625988A (zh) | 一种晶圆表面成分检测方法及其装置 | |
JPS5757245A (en) | Inspecting method and device for appearance of semiconductor wafer | |
JPS5815265B2 (ja) | 自動形状修正研摩装置 | |
CN205538927U (zh) | 一种用于幕墙中空玻璃充气用的侧充气检测挡板 | |
JPS56118347A (en) | Drying device | |
JPS57168725A (en) | Bending angle detector of bending machine | |
CN214408560U (zh) | 一种陶瓷浸润检测设备 | |
CN115753817B (zh) | 一种硅晶圆片表面缺陷的视觉检测设备 | |
BE882938Q (fr) | Appareil a detecter les defauts de surface en particulier sur semi produits siderurgiques | |
JPS5762861A (en) | Automatic gas cutter for curved surface | |
JPS56130938A (en) | Inspecting apparatus of semiconductor pellet | |
JP2844210B2 (ja) | 回転処理方法および装置 | |
JPS55124232A (en) | Application method of substrate treatment solution and the device therefor | |
JPH07251371A (ja) | 薄膜形成用研磨方法及び薄膜形成用研磨装置 | |
JPS531585A (en) | Ultrasonic flaw detector | |
JPS5670634A (en) | Rotatable coating method | |
JPS5412568A (en) | Aligning method of semiconductor wafers | |
JPS5539627A (en) | Automatic device for measuring specific resistance distribution of semiconductor |