JPS57186750A - Applying method of photoresist - Google Patents
Applying method of photoresistInfo
- Publication number
- JPS57186750A JPS57186750A JP7165581A JP7165581A JPS57186750A JP S57186750 A JPS57186750 A JP S57186750A JP 7165581 A JP7165581 A JP 7165581A JP 7165581 A JP7165581 A JP 7165581A JP S57186750 A JPS57186750 A JP S57186750A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- resist
- surrounding part
- photoresist
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
PURPOSE:To prevent the surrounding part and side surface of a wafer from applying of photoresist, by covering the surrounding part of the wafer with a cover in case of applying with a shower or in spraying. CONSTITUTION:A nozzle to blow photoresist liquid, specially a positive type liquid to a wafer in showering or spraying is provided, and a wafer 31 which applies a resist is provided under the nozzle. Around the wafer 31, a cover 42 is fitted only to a surrounding part so that the resist is not applied on it. By this way, it is eliminated that the resist rises to become thicker around the wafer and the resist adheres to its side surface. Specially in case that a positive type resist is used, a light does not reach easily to the surrounding part and side surface of the wafer and the resist remains often there, therefore this way is effective.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7165581A JPS57186750A (en) | 1981-05-12 | 1981-05-12 | Applying method of photoresist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7165581A JPS57186750A (en) | 1981-05-12 | 1981-05-12 | Applying method of photoresist |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57186750A true JPS57186750A (en) | 1982-11-17 |
Family
ID=13466836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7165581A Pending JPS57186750A (en) | 1981-05-12 | 1981-05-12 | Applying method of photoresist |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57186750A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0766191B2 (en) * | 1984-10-29 | 1995-07-19 | アメリカン テレフォン アンド テレグラフ カムパニー | Device fabrication method using non-planar surface lithography |
-
1981
- 1981-05-12 JP JP7165581A patent/JPS57186750A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0766191B2 (en) * | 1984-10-29 | 1995-07-19 | アメリカン テレフォン アンド テレグラフ カムパニー | Device fabrication method using non-planar surface lithography |
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