JPS57184295A - Copper foil for printed circuit and method of producing same - Google Patents
Copper foil for printed circuit and method of producing sameInfo
- Publication number
- JPS57184295A JPS57184295A JP6837381A JP6837381A JPS57184295A JP S57184295 A JPS57184295 A JP S57184295A JP 6837381 A JP6837381 A JP 6837381A JP 6837381 A JP6837381 A JP 6837381A JP S57184295 A JPS57184295 A JP S57184295A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- copper foil
- producing same
- producing
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 239000011889 copper foil Substances 0.000 title 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6837381A JPS57184295A (en) | 1981-05-08 | 1981-05-08 | Copper foil for printed circuit and method of producing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6837381A JPS57184295A (en) | 1981-05-08 | 1981-05-08 | Copper foil for printed circuit and method of producing same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57184295A true JPS57184295A (en) | 1982-11-12 |
JPS6256677B2 JPS6256677B2 (enrdf_load_stackoverflow) | 1987-11-26 |
Family
ID=13371876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6837381A Granted JPS57184295A (en) | 1981-05-08 | 1981-05-08 | Copper foil for printed circuit and method of producing same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57184295A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63282780A (ja) * | 1987-05-15 | 1988-11-18 | キヤノン株式会社 | 素子配線電極及びその製造方法 |
US5248238A (en) * | 1991-04-15 | 1993-09-28 | Nippondenso Co., Ltd. | Vortex pump |
US5366814A (en) * | 1992-11-19 | 1994-11-22 | Nikko Gould Foil Co., Ltd. | Copper foil for printed circuits and process for producing the same |
WO2017099094A1 (ja) * | 2015-12-09 | 2017-06-15 | 古河電気工業株式会社 | プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板 |
-
1981
- 1981-05-08 JP JP6837381A patent/JPS57184295A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63282780A (ja) * | 1987-05-15 | 1988-11-18 | キヤノン株式会社 | 素子配線電極及びその製造方法 |
US5248238A (en) * | 1991-04-15 | 1993-09-28 | Nippondenso Co., Ltd. | Vortex pump |
US5366814A (en) * | 1992-11-19 | 1994-11-22 | Nikko Gould Foil Co., Ltd. | Copper foil for printed circuits and process for producing the same |
WO2017099094A1 (ja) * | 2015-12-09 | 2017-06-15 | 古河電気工業株式会社 | プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板 |
CN107109664A (zh) * | 2015-12-09 | 2017-08-29 | 古河电气工业株式会社 | 印刷线路板用表面处理铜箔、印刷线路板用覆铜层压板和印刷线路板 |
CN107109664B (zh) * | 2015-12-09 | 2019-03-26 | 古河电气工业株式会社 | 印刷线路板用表面处理铜箔、印刷线路板用覆铜层压板和印刷线路板 |
Also Published As
Publication number | Publication date |
---|---|
JPS6256677B2 (enrdf_load_stackoverflow) | 1987-11-26 |
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