JPS57184244A - Metallic member for electronic parts - Google Patents
Metallic member for electronic partsInfo
- Publication number
- JPS57184244A JPS57184244A JP6981381A JP6981381A JPS57184244A JP S57184244 A JPS57184244 A JP S57184244A JP 6981381 A JP6981381 A JP 6981381A JP 6981381 A JP6981381 A JP 6981381A JP S57184244 A JPS57184244 A JP S57184244A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- silver
- plated layer
- layer
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 6
- 229910052709 silver Inorganic materials 0.000 abstract 6
- 239000004332 silver Substances 0.000 abstract 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 239000011669 selenium Substances 0.000 abstract 3
- 229910052711 selenium Inorganic materials 0.000 abstract 3
- 230000007797 corrosion Effects 0.000 abstract 2
- 238000005260 corrosion Methods 0.000 abstract 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 1
- 230000001668 ameliorated effect Effects 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 abstract 1
- 229940098221 silver cyanide Drugs 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6981381A JPS57184244A (en) | 1981-05-08 | 1981-05-08 | Metallic member for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6981381A JPS57184244A (en) | 1981-05-08 | 1981-05-08 | Metallic member for electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57184244A true JPS57184244A (en) | 1982-11-12 |
| JPS6344299B2 JPS6344299B2 (enrdf_load_stackoverflow) | 1988-09-05 |
Family
ID=13413568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6981381A Granted JPS57184244A (en) | 1981-05-08 | 1981-05-08 | Metallic member for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57184244A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010199166A (ja) * | 2009-02-24 | 2010-09-09 | Panasonic Corp | 光半導体装置用リードフレームおよび光半導体装置用リードフレームの製造方法 |
| US11011476B2 (en) | 2018-03-12 | 2021-05-18 | Stmicroelectronics International N.V. | Lead frame surface finishing |
| US11735512B2 (en) | 2018-12-31 | 2023-08-22 | Stmicroelectronics International N.V. | Leadframe with a metal oxide coating and method of forming the same |
-
1981
- 1981-05-08 JP JP6981381A patent/JPS57184244A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010199166A (ja) * | 2009-02-24 | 2010-09-09 | Panasonic Corp | 光半導体装置用リードフレームおよび光半導体装置用リードフレームの製造方法 |
| US11011476B2 (en) | 2018-03-12 | 2021-05-18 | Stmicroelectronics International N.V. | Lead frame surface finishing |
| US11756899B2 (en) | 2018-03-12 | 2023-09-12 | Stmicroelectronics S.R.L. | Lead frame surface finishing |
| US11735512B2 (en) | 2018-12-31 | 2023-08-22 | Stmicroelectronics International N.V. | Leadframe with a metal oxide coating and method of forming the same |
| US12362195B2 (en) | 2018-12-31 | 2025-07-15 | Stmicroelectronics International N.V. | Leadframe with a metal oxide coating and method of forming the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6344299B2 (enrdf_load_stackoverflow) | 1988-09-05 |
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