JPS57172922A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS57172922A
JPS57172922A JP5709281A JP5709281A JPS57172922A JP S57172922 A JPS57172922 A JP S57172922A JP 5709281 A JP5709281 A JP 5709281A JP 5709281 A JP5709281 A JP 5709281A JP S57172922 A JPS57172922 A JP S57172922A
Authority
JP
Japan
Prior art keywords
composition
heat
resin composition
resistant resin
hydroxystyrene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5709281A
Other languages
Japanese (ja)
Other versions
JPH0158207B2 (en
Inventor
Akio Nishikawa
Shunichi Numata
Koji Fujisaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5709281A priority Critical patent/JPS57172922A/en
Publication of JPS57172922A publication Critical patent/JPS57172922A/en
Publication of JPH0158207B2 publication Critical patent/JPH0158207B2/ja
Granted legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

PURPOSE: To enhance the solubility of a composition and to make it possible to convert the composition into cured products excellent in high-temperature strength by a short period heating, by mixing a bismaleimide with an N-vinylpyrrolidone compound and poly-p-hydroxystyrene.
CONSTITUTION: This composition contains a bismaleimide represented by formula I, wherein R1 is H or CH3 and R2 is a bivalent organic group, an N-vinylpyrrolidone compound and poly-p-hydroxystyrene. This composition dissolves well in a solvent, and when heated to the temperature range of about 150W200°C for a short time, it is converted into a cured product excellent in high-temperature strength.
COPYRIGHT: (C)1982,JPO&Japio
JP5709281A 1981-04-17 1981-04-17 Heat-resistant resin composition Granted JPS57172922A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5709281A JPS57172922A (en) 1981-04-17 1981-04-17 Heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5709281A JPS57172922A (en) 1981-04-17 1981-04-17 Heat-resistant resin composition

Publications (2)

Publication Number Publication Date
JPS57172922A true JPS57172922A (en) 1982-10-25
JPH0158207B2 JPH0158207B2 (en) 1989-12-11

Family

ID=13045853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5709281A Granted JPS57172922A (en) 1981-04-17 1981-04-17 Heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS57172922A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0299545A (en) * 1988-10-07 1990-04-11 Hitachi Ltd Thermosetting resin composition and prepreg and laminated board using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0299545A (en) * 1988-10-07 1990-04-11 Hitachi Ltd Thermosetting resin composition and prepreg and laminated board using the same

Also Published As

Publication number Publication date
JPH0158207B2 (en) 1989-12-11

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