JPS57170560U - - Google Patents
Info
- Publication number
- JPS57170560U JPS57170560U JP1981056568U JP5656881U JPS57170560U JP S57170560 U JPS57170560 U JP S57170560U JP 1981056568 U JP1981056568 U JP 1981056568U JP 5656881 U JP5656881 U JP 5656881U JP S57170560 U JPS57170560 U JP S57170560U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
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- H10W72/5363—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981056568U JPS57170560U (enExample) | 1981-04-21 | 1981-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981056568U JPS57170560U (enExample) | 1981-04-21 | 1981-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57170560U true JPS57170560U (enExample) | 1982-10-27 |
Family
ID=29853070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981056568U Pending JPS57170560U (enExample) | 1981-04-21 | 1981-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57170560U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010028149A (ja) * | 2005-05-30 | 2010-02-04 | Samsung Electro-Mechanics Co Ltd | 高出力ｌｅｄパッケージの製造方法 |
| JP2013098199A (ja) * | 2011-10-28 | 2013-05-20 | Mitsubishi Electric Corp | 電力用半導体装置および電力用半導体装置の製造方法 |
| JP2015170787A (ja) * | 2014-03-10 | 2015-09-28 | 新電元工業株式会社 | 樹脂封止型半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5619642A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Resin-sealed semiconductor device |
| JPS57114266A (en) * | 1981-01-07 | 1982-07-16 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
-
1981
- 1981-04-21 JP JP1981056568U patent/JPS57170560U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5619642A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Resin-sealed semiconductor device |
| JPS57114266A (en) * | 1981-01-07 | 1982-07-16 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010028149A (ja) * | 2005-05-30 | 2010-02-04 | Samsung Electro-Mechanics Co Ltd | 高出力ｌｅｄパッケージの製造方法 |
| JP2013098199A (ja) * | 2011-10-28 | 2013-05-20 | Mitsubishi Electric Corp | 電力用半導体装置および電力用半導体装置の製造方法 |
| JP2015170787A (ja) * | 2014-03-10 | 2015-09-28 | 新電元工業株式会社 | 樹脂封止型半導体装置 |