JPS57170560U - - Google Patents

Info

Publication number
JPS57170560U
JPS57170560U JP5656881U JP5656881U JPS57170560U JP S57170560 U JPS57170560 U JP S57170560U JP 5656881 U JP5656881 U JP 5656881U JP 5656881 U JP5656881 U JP 5656881U JP S57170560 U JPS57170560 U JP S57170560U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5656881U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5656881U priority Critical patent/JPS57170560U/ja
Publication of JPS57170560U publication Critical patent/JPS57170560U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5656881U 1981-04-21 1981-04-21 Pending JPS57170560U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5656881U JPS57170560U (ja) 1981-04-21 1981-04-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5656881U JPS57170560U (ja) 1981-04-21 1981-04-21

Publications (1)

Publication Number Publication Date
JPS57170560U true JPS57170560U (ja) 1982-10-27

Family

ID=29853070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5656881U Pending JPS57170560U (ja) 1981-04-21 1981-04-21

Country Status (1)

Country Link
JP (1) JPS57170560U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010028149A (ja) * 2005-05-30 2010-02-04 Samsung Electro-Mechanics Co Ltd 高出力ｌｅｄパッケージの製造方法
JP2013098199A (ja) * 2011-10-28 2013-05-20 Mitsubishi Electric Corp 電力用半導体装置および電力用半導体装置の製造方法
JP2015170787A (ja) * 2014-03-10 2015-09-28 新電元工業株式会社 樹脂封止型半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619642A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Resin-sealed semiconductor device
JPS57114266A (en) * 1981-01-07 1982-07-16 Mitsubishi Electric Corp Resin-sealed semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619642A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Resin-sealed semiconductor device
JPS57114266A (en) * 1981-01-07 1982-07-16 Mitsubishi Electric Corp Resin-sealed semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010028149A (ja) * 2005-05-30 2010-02-04 Samsung Electro-Mechanics Co Ltd 高出力ｌｅｄパッケージの製造方法
JP2013098199A (ja) * 2011-10-28 2013-05-20 Mitsubishi Electric Corp 電力用半導体装置および電力用半導体装置の製造方法
JP2015170787A (ja) * 2014-03-10 2015-09-28 新電元工業株式会社 樹脂封止型半導体装置

Similar Documents

Publication Publication Date Title
FR2501380B1 (ja)
FR2501840B1 (ja)
FR2502205B1 (ja)
FR2502209B2 (ja)
FR2502113B1 (ja)
FR2500180B1 (ja)
FR2500776B1 (ja)
FR2501931B1 (ja)
FR2499466B1 (ja)
FR2500406B1 (ja)
FR2501231B1 (ja)
FR2500251B1 (ja)
FR2500730B1 (ja)
FR2502676B3 (ja)
FR2502423B1 (ja)
FR2500454B1 (ja)
FR2501020B1 (ja)
FR2503689B1 (ja)
FR2507025B1 (ja)
FR2500966B1 (ja)
FR2500613B3 (ja)
FR2500999B1 (ja)
FR2502212B3 (ja)
FR2499428B3 (ja)
JPS57170560U (ja)