JPS57167646A - Ultrasonic wire bonding method - Google Patents

Ultrasonic wire bonding method

Info

Publication number
JPS57167646A
JPS57167646A JP56052801A JP5280181A JPS57167646A JP S57167646 A JPS57167646 A JP S57167646A JP 56052801 A JP56052801 A JP 56052801A JP 5280181 A JP5280181 A JP 5280181A JP S57167646 A JPS57167646 A JP S57167646A
Authority
JP
Japan
Prior art keywords
wire
section
bonding
sample
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56052801A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6158977B2 (enExample
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56052801A priority Critical patent/JPS57167646A/ja
Publication of JPS57167646A publication Critical patent/JPS57167646A/ja
Publication of JPS6158977B2 publication Critical patent/JPS6158977B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding

Landscapes

  • Wire Bonding (AREA)
JP56052801A 1981-04-08 1981-04-08 Ultrasonic wire bonding method Granted JPS57167646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56052801A JPS57167646A (en) 1981-04-08 1981-04-08 Ultrasonic wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56052801A JPS57167646A (en) 1981-04-08 1981-04-08 Ultrasonic wire bonding method

Publications (2)

Publication Number Publication Date
JPS57167646A true JPS57167646A (en) 1982-10-15
JPS6158977B2 JPS6158977B2 (enExample) 1986-12-13

Family

ID=12924940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56052801A Granted JPS57167646A (en) 1981-04-08 1981-04-08 Ultrasonic wire bonding method

Country Status (1)

Country Link
JP (1) JPS57167646A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182774U (enExample) * 1984-10-31 1986-05-31
JPH04104276U (ja) * 1991-02-14 1992-09-08 大谷櫻井鐵工株式会社 フエルール

Also Published As

Publication number Publication date
JPS6158977B2 (enExample) 1986-12-13

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