JPS57167640A - Sealing method for semiconductor element with resin - Google Patents
Sealing method for semiconductor element with resinInfo
- Publication number
- JPS57167640A JPS57167640A JP5169381A JP5169381A JPS57167640A JP S57167640 A JPS57167640 A JP S57167640A JP 5169381 A JP5169381 A JP 5169381A JP 5169381 A JP5169381 A JP 5169381A JP S57167640 A JPS57167640 A JP S57167640A
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- resin
- pressure
- cavity
- stages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To increase pressure in the cavity of a die by stages, and to prevent the generation of burr by detecting the position of the plunger of a cylinder for pushing the resin and augmenting the push-down force of the plunger after the plunger reaches a predetermined position. CONSTITUTION:An oil liquid discharged from a pump 24 is forwarded to the cylinder 28 through a check valve 25, a changeover valve 22 and flow-rate control valves 26, 27, and downward pushed the plunger 29. The resin in a pot 31b is sent to the cavity 31a of the die 31 by pressure through the fall of the plunger 29. The position of the plunger 29 is detected by means of a positional sensor 29', and detecting signals are compared with set value by means of a comparator 32. When the position of the plunger 29 reaches the set value, signals are transmitted to a pressure control valve 35 from a controller 34, the push-down force of the plunger 29 is increased, and pressure in the cavity 31a is augmented by stages.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5169381A JPS57167640A (en) | 1981-04-08 | 1981-04-08 | Sealing method for semiconductor element with resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5169381A JPS57167640A (en) | 1981-04-08 | 1981-04-08 | Sealing method for semiconductor element with resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57167640A true JPS57167640A (en) | 1982-10-15 |
Family
ID=12893975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5169381A Pending JPS57167640A (en) | 1981-04-08 | 1981-04-08 | Sealing method for semiconductor element with resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57167640A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6025239A (en) * | 1983-07-20 | 1985-02-08 | Nec Kansai Ltd | Resin molding of electronic parts |
JPS61117843A (en) * | 1984-11-14 | 1986-06-05 | Sumitomo Heavy Ind Ltd | Semiconductor resin-sealing method |
JPH04111737U (en) * | 1991-03-13 | 1992-09-29 | 株式会社東芝 | Control device for semiconductor molding equipment |
JPH06315960A (en) * | 1994-04-08 | 1994-11-15 | Hitachi Ltd | Resin sealing method of semiconductor |
JP2009101615A (en) * | 2007-10-24 | 2009-05-14 | Apic Yamada Corp | Transfer resin molding method and transfer molding apparatus |
-
1981
- 1981-04-08 JP JP5169381A patent/JPS57167640A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6025239A (en) * | 1983-07-20 | 1985-02-08 | Nec Kansai Ltd | Resin molding of electronic parts |
JPS61117843A (en) * | 1984-11-14 | 1986-06-05 | Sumitomo Heavy Ind Ltd | Semiconductor resin-sealing method |
JPH04111737U (en) * | 1991-03-13 | 1992-09-29 | 株式会社東芝 | Control device for semiconductor molding equipment |
JPH06315960A (en) * | 1994-04-08 | 1994-11-15 | Hitachi Ltd | Resin sealing method of semiconductor |
JP2009101615A (en) * | 2007-10-24 | 2009-05-14 | Apic Yamada Corp | Transfer resin molding method and transfer molding apparatus |
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