JPS57167640A - Sealing method for semiconductor element with resin - Google Patents

Sealing method for semiconductor element with resin

Info

Publication number
JPS57167640A
JPS57167640A JP5169381A JP5169381A JPS57167640A JP S57167640 A JPS57167640 A JP S57167640A JP 5169381 A JP5169381 A JP 5169381A JP 5169381 A JP5169381 A JP 5169381A JP S57167640 A JPS57167640 A JP S57167640A
Authority
JP
Japan
Prior art keywords
plunger
resin
pressure
cavity
stages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5169381A
Other languages
Japanese (ja)
Inventor
Michitoshi Sera
Masahiro Kodama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5169381A priority Critical patent/JPS57167640A/en
Publication of JPS57167640A publication Critical patent/JPS57167640A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To increase pressure in the cavity of a die by stages, and to prevent the generation of burr by detecting the position of the plunger of a cylinder for pushing the resin and augmenting the push-down force of the plunger after the plunger reaches a predetermined position. CONSTITUTION:An oil liquid discharged from a pump 24 is forwarded to the cylinder 28 through a check valve 25, a changeover valve 22 and flow-rate control valves 26, 27, and downward pushed the plunger 29. The resin in a pot 31b is sent to the cavity 31a of the die 31 by pressure through the fall of the plunger 29. The position of the plunger 29 is detected by means of a positional sensor 29', and detecting signals are compared with set value by means of a comparator 32. When the position of the plunger 29 reaches the set value, signals are transmitted to a pressure control valve 35 from a controller 34, the push-down force of the plunger 29 is increased, and pressure in the cavity 31a is augmented by stages.
JP5169381A 1981-04-08 1981-04-08 Sealing method for semiconductor element with resin Pending JPS57167640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5169381A JPS57167640A (en) 1981-04-08 1981-04-08 Sealing method for semiconductor element with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5169381A JPS57167640A (en) 1981-04-08 1981-04-08 Sealing method for semiconductor element with resin

Publications (1)

Publication Number Publication Date
JPS57167640A true JPS57167640A (en) 1982-10-15

Family

ID=12893975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5169381A Pending JPS57167640A (en) 1981-04-08 1981-04-08 Sealing method for semiconductor element with resin

Country Status (1)

Country Link
JP (1) JPS57167640A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025239A (en) * 1983-07-20 1985-02-08 Nec Kansai Ltd Resin molding of electronic parts
JPS61117843A (en) * 1984-11-14 1986-06-05 Sumitomo Heavy Ind Ltd Semiconductor resin-sealing method
JPH04111737U (en) * 1991-03-13 1992-09-29 株式会社東芝 Control device for semiconductor molding equipment
JPH06315960A (en) * 1994-04-08 1994-11-15 Hitachi Ltd Resin sealing method of semiconductor
JP2009101615A (en) * 2007-10-24 2009-05-14 Apic Yamada Corp Transfer resin molding method and transfer molding apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025239A (en) * 1983-07-20 1985-02-08 Nec Kansai Ltd Resin molding of electronic parts
JPS61117843A (en) * 1984-11-14 1986-06-05 Sumitomo Heavy Ind Ltd Semiconductor resin-sealing method
JPH04111737U (en) * 1991-03-13 1992-09-29 株式会社東芝 Control device for semiconductor molding equipment
JPH06315960A (en) * 1994-04-08 1994-11-15 Hitachi Ltd Resin sealing method of semiconductor
JP2009101615A (en) * 2007-10-24 2009-05-14 Apic Yamada Corp Transfer resin molding method and transfer molding apparatus

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