JPS57164566A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57164566A
JPS57164566A JP5009681A JP5009681A JPS57164566A JP S57164566 A JPS57164566 A JP S57164566A JP 5009681 A JP5009681 A JP 5009681A JP 5009681 A JP5009681 A JP 5009681A JP S57164566 A JPS57164566 A JP S57164566A
Authority
JP
Japan
Prior art keywords
thyristor
exchanging tube
electrode
heat exchanging
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5009681A
Other languages
Japanese (ja)
Inventor
Mikio Hatakeyama
Takashi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5009681A priority Critical patent/JPS57164566A/en
Publication of JPS57164566A publication Critical patent/JPS57164566A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)

Abstract

PURPOSE:To perform heat radiation from a semiconductor pellet with extremely good efficiency, by providing a heat exchanging tube as a metallic electrode for taking out current. CONSTITUTION:A heat compensating plate 2 of tungsten is soldered and fixed to the center of the upper surface of a copper base 1 serving as an anode metallic electrode and radiator, and further, the surface of the anode electrode of a thyristor 3 is soldered on the upper surface thereof. The heating part 4a at one end of the heat exchanging tube 4 is soldered on the surface of the cathode electrode of the thyristor 3 with a cathode lead 5 mounted on the heating part 4c at the other end extended through the fitting part of the radiating fin of the heat exchanging tube 4 by a screw. The thyristor 3 is surrounded by the side walls 7 of the case of an insulator 6 being airtight-sealed. Thus, the heat generated in the thyristor 3 is radiated with good efficiency from the radiating fin 4d on the outside of the heat exchanging tube 4 as a metallic electrode for taking out the current of the cathode electrode.
JP5009681A 1981-04-03 1981-04-03 Semiconductor device Pending JPS57164566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5009681A JPS57164566A (en) 1981-04-03 1981-04-03 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5009681A JPS57164566A (en) 1981-04-03 1981-04-03 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57164566A true JPS57164566A (en) 1982-10-09

Family

ID=12849525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5009681A Pending JPS57164566A (en) 1981-04-03 1981-04-03 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57164566A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5925929A (en) * 1992-07-03 1999-07-20 Hitachi, Ltd. Cooling apparatus for electronic elements

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5925929A (en) * 1992-07-03 1999-07-20 Hitachi, Ltd. Cooling apparatus for electronic elements

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