JPS57164542A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57164542A
JPS57164542A JP56047170A JP4717081A JPS57164542A JP S57164542 A JPS57164542 A JP S57164542A JP 56047170 A JP56047170 A JP 56047170A JP 4717081 A JP4717081 A JP 4717081A JP S57164542 A JPS57164542 A JP S57164542A
Authority
JP
Japan
Prior art keywords
wire
elements
alloy
less
improve anti
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56047170A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6353694B2 (enExample
Inventor
Hiroshi Yamamoto
Matsunosuke Kikuchi
Seiichi Iwata
Kanji Otsuka
Kensuke Nakada
Michio Tanimoto
Satoru Matsubara
Yasuo Fukui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Hitachi Ltd
Original Assignee
Tanaka Denshi Kogyo KK
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK, Hitachi Ltd filed Critical Tanaka Denshi Kogyo KK
Priority to JP56047170A priority Critical patent/JPS57164542A/ja
Publication of JPS57164542A publication Critical patent/JPS57164542A/ja
Publication of JPS6353694B2 publication Critical patent/JPS6353694B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Wire Bonding (AREA)
JP56047170A 1981-04-01 1981-04-01 Semiconductor device Granted JPS57164542A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56047170A JPS57164542A (en) 1981-04-01 1981-04-01 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56047170A JPS57164542A (en) 1981-04-01 1981-04-01 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57164542A true JPS57164542A (en) 1982-10-09
JPS6353694B2 JPS6353694B2 (enExample) 1988-10-25

Family

ID=12767585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56047170A Granted JPS57164542A (en) 1981-04-01 1981-04-01 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57164542A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58124235A (ja) * 1982-01-20 1983-07-23 Hitachi Cable Ltd 半導体装置用アルミ合金極細線
JPS607165A (ja) * 1983-06-24 1985-01-14 Sumitomo Electric Ind Ltd ボンディングワイヤ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63186592U (enExample) * 1987-05-25 1988-11-30

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58124235A (ja) * 1982-01-20 1983-07-23 Hitachi Cable Ltd 半導体装置用アルミ合金極細線
JPS607165A (ja) * 1983-06-24 1985-01-14 Sumitomo Electric Ind Ltd ボンディングワイヤ

Also Published As

Publication number Publication date
JPS6353694B2 (enExample) 1988-10-25

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