JPS57162396A - High density mounting circuit board and method of producing same - Google Patents
High density mounting circuit board and method of producing sameInfo
- Publication number
- JPS57162396A JPS57162396A JP56047060A JP4706081A JPS57162396A JP S57162396 A JPS57162396 A JP S57162396A JP 56047060 A JP56047060 A JP 56047060A JP 4706081 A JP4706081 A JP 4706081A JP S57162396 A JPS57162396 A JP S57162396A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- high density
- producing same
- density mounting
- mounting circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56047060A JPS57162396A (en) | 1981-03-30 | 1981-03-30 | High density mounting circuit board and method of producing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56047060A JPS57162396A (en) | 1981-03-30 | 1981-03-30 | High density mounting circuit board and method of producing same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57162396A true JPS57162396A (en) | 1982-10-06 |
JPS6226200B2 JPS6226200B2 (enrdf_load_stackoverflow) | 1987-06-08 |
Family
ID=12764603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56047060A Granted JPS57162396A (en) | 1981-03-30 | 1981-03-30 | High density mounting circuit board and method of producing same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57162396A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59171352U (ja) * | 1983-04-30 | 1984-11-16 | 富士通株式会社 | 半導体装置 |
JPS62173799A (ja) * | 1986-01-28 | 1987-07-30 | 富士通株式会社 | 高密度実装基板の製造方法 |
-
1981
- 1981-03-30 JP JP56047060A patent/JPS57162396A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59171352U (ja) * | 1983-04-30 | 1984-11-16 | 富士通株式会社 | 半導体装置 |
JPS62173799A (ja) * | 1986-01-28 | 1987-07-30 | 富士通株式会社 | 高密度実装基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6226200B2 (enrdf_load_stackoverflow) | 1987-06-08 |
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