JPS57162396A - High density mounting circuit board and method of producing same - Google Patents

High density mounting circuit board and method of producing same

Info

Publication number
JPS57162396A
JPS57162396A JP56047060A JP4706081A JPS57162396A JP S57162396 A JPS57162396 A JP S57162396A JP 56047060 A JP56047060 A JP 56047060A JP 4706081 A JP4706081 A JP 4706081A JP S57162396 A JPS57162396 A JP S57162396A
Authority
JP
Japan
Prior art keywords
circuit board
high density
producing same
density mounting
mounting circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56047060A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6226200B2 (enrdf_load_stackoverflow
Inventor
Nobuo Kamehara
Nobuo Nishihara
Hanao Murase
Kishio Yokouchi
Kouichi Niwa
Kiyouhei Murakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56047060A priority Critical patent/JPS57162396A/ja
Publication of JPS57162396A publication Critical patent/JPS57162396A/ja
Publication of JPS6226200B2 publication Critical patent/JPS6226200B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP56047060A 1981-03-30 1981-03-30 High density mounting circuit board and method of producing same Granted JPS57162396A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56047060A JPS57162396A (en) 1981-03-30 1981-03-30 High density mounting circuit board and method of producing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56047060A JPS57162396A (en) 1981-03-30 1981-03-30 High density mounting circuit board and method of producing same

Publications (2)

Publication Number Publication Date
JPS57162396A true JPS57162396A (en) 1982-10-06
JPS6226200B2 JPS6226200B2 (enrdf_load_stackoverflow) 1987-06-08

Family

ID=12764603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56047060A Granted JPS57162396A (en) 1981-03-30 1981-03-30 High density mounting circuit board and method of producing same

Country Status (1)

Country Link
JP (1) JPS57162396A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171352U (ja) * 1983-04-30 1984-11-16 富士通株式会社 半導体装置
JPS62173799A (ja) * 1986-01-28 1987-07-30 富士通株式会社 高密度実装基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171352U (ja) * 1983-04-30 1984-11-16 富士通株式会社 半導体装置
JPS62173799A (ja) * 1986-01-28 1987-07-30 富士通株式会社 高密度実装基板の製造方法

Also Published As

Publication number Publication date
JPS6226200B2 (enrdf_load_stackoverflow) 1987-06-08

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