JPS57162343A - Characteristics measuring instrument for film carrier semiconductor device - Google Patents

Characteristics measuring instrument for film carrier semiconductor device

Info

Publication number
JPS57162343A
JPS57162343A JP4737581A JP4737581A JPS57162343A JP S57162343 A JPS57162343 A JP S57162343A JP 4737581 A JP4737581 A JP 4737581A JP 4737581 A JP4737581 A JP 4737581A JP S57162343 A JPS57162343 A JP S57162343A
Authority
JP
Japan
Prior art keywords
film carrier
semiconductor device
measuring instrument
probe needle
characteristics measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4737581A
Other languages
English (en)
Other versions
JPS6157699B2 (ja
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4737581A priority Critical patent/JPS57162343A/ja
Publication of JPS57162343A publication Critical patent/JPS57162343A/ja
Publication of JPS6157699B2 publication Critical patent/JPS6157699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP4737581A 1981-03-31 1981-03-31 Characteristics measuring instrument for film carrier semiconductor device Granted JPS57162343A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4737581A JPS57162343A (en) 1981-03-31 1981-03-31 Characteristics measuring instrument for film carrier semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4737581A JPS57162343A (en) 1981-03-31 1981-03-31 Characteristics measuring instrument for film carrier semiconductor device

Publications (2)

Publication Number Publication Date
JPS57162343A true JPS57162343A (en) 1982-10-06
JPS6157699B2 JPS6157699B2 (ja) 1986-12-08

Family

ID=12773346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4737581A Granted JPS57162343A (en) 1981-03-31 1981-03-31 Characteristics measuring instrument for film carrier semiconductor device

Country Status (1)

Country Link
JP (1) JPS57162343A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5330919A (en) * 1993-02-08 1994-07-19 Motorola, Inc. Method for electrically testing a semiconductor die using a test apparatus having an independent conductive plane
US7217990B2 (en) * 2003-01-14 2007-05-15 Samsung Electronics Co., Ltd. Tape package having test pad on reverse surface and method for testing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6266498U (ja) * 1985-10-15 1987-04-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5330919A (en) * 1993-02-08 1994-07-19 Motorola, Inc. Method for electrically testing a semiconductor die using a test apparatus having an independent conductive plane
US7217990B2 (en) * 2003-01-14 2007-05-15 Samsung Electronics Co., Ltd. Tape package having test pad on reverse surface and method for testing the same

Also Published As

Publication number Publication date
JPS6157699B2 (ja) 1986-12-08

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