JPS57159050A - Liquid cooled module - Google Patents

Liquid cooled module

Info

Publication number
JPS57159050A
JPS57159050A JP4452681A JP4452681A JPS57159050A JP S57159050 A JPS57159050 A JP S57159050A JP 4452681 A JP4452681 A JP 4452681A JP 4452681 A JP4452681 A JP 4452681A JP S57159050 A JPS57159050 A JP S57159050A
Authority
JP
Japan
Prior art keywords
radiating unit
inner plate
circuit substrate
fluid channel
heating elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4452681A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6161703B2 (enrdf_load_stackoverflow
Inventor
Kishio Yokouchi
Nobuo Kamehara
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4452681A priority Critical patent/JPS57159050A/ja
Publication of JPS57159050A publication Critical patent/JPS57159050A/ja
Publication of JPS6161703B2 publication Critical patent/JPS6161703B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP4452681A 1981-03-26 1981-03-26 Liquid cooled module Granted JPS57159050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4452681A JPS57159050A (en) 1981-03-26 1981-03-26 Liquid cooled module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4452681A JPS57159050A (en) 1981-03-26 1981-03-26 Liquid cooled module

Publications (2)

Publication Number Publication Date
JPS57159050A true JPS57159050A (en) 1982-10-01
JPS6161703B2 JPS6161703B2 (enrdf_load_stackoverflow) 1986-12-26

Family

ID=12693959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4452681A Granted JPS57159050A (en) 1981-03-26 1981-03-26 Liquid cooled module

Country Status (1)

Country Link
JP (1) JPS57159050A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990006592A1 (en) * 1988-12-05 1990-06-14 Sundstrand Corporation Hydrostatic clamp for compression type power semiconductors
WO2000055887A3 (de) * 1999-03-15 2001-01-11 Gruendl & Hoffmann Gehäuse für elektronische schaltungen
US8059404B2 (en) * 2008-10-09 2011-11-15 GM Global Technology Operations LLC Power inverters

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990006592A1 (en) * 1988-12-05 1990-06-14 Sundstrand Corporation Hydrostatic clamp for compression type power semiconductors
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors
WO2000055887A3 (de) * 1999-03-15 2001-01-11 Gruendl & Hoffmann Gehäuse für elektronische schaltungen
US8059404B2 (en) * 2008-10-09 2011-11-15 GM Global Technology Operations LLC Power inverters

Also Published As

Publication number Publication date
JPS6161703B2 (enrdf_load_stackoverflow) 1986-12-26

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