JPS57158542A - Bonding strength testing device - Google Patents

Bonding strength testing device

Info

Publication number
JPS57158542A
JPS57158542A JP4378381A JP4378381A JPS57158542A JP S57158542 A JPS57158542 A JP S57158542A JP 4378381 A JP4378381 A JP 4378381A JP 4378381 A JP4378381 A JP 4378381A JP S57158542 A JPS57158542 A JP S57158542A
Authority
JP
Japan
Prior art keywords
arm
bonding strength
tested
tip
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4378381A
Other languages
English (en)
Inventor
Misao Miyano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4378381A priority Critical patent/JPS57158542A/ja
Publication of JPS57158542A publication Critical patent/JPS57158542A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP4378381A 1981-03-25 1981-03-25 Bonding strength testing device Pending JPS57158542A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4378381A JPS57158542A (en) 1981-03-25 1981-03-25 Bonding strength testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4378381A JPS57158542A (en) 1981-03-25 1981-03-25 Bonding strength testing device

Publications (1)

Publication Number Publication Date
JPS57158542A true JPS57158542A (en) 1982-09-30

Family

ID=12673352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4378381A Pending JPS57158542A (en) 1981-03-25 1981-03-25 Bonding strength testing device

Country Status (1)

Country Link
JP (1) JPS57158542A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104359834A (zh) * 2014-11-02 2015-02-18 广东工业大学 一种综合纵向力和切向力的界面结合强度检测平台

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104359834A (zh) * 2014-11-02 2015-02-18 广东工业大学 一种综合纵向力和切向力的界面结合强度检测平台

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